Bicheng Enterprise Company

Guangdong, China

We are offering gold finger printed circuit boards (pcb). 1). 98*32mm/1up, fr-4 material2). 8 layer, 1.0mm thick, 35 m (1 oz)3). Lpi green solder mask/white silk screen legend4). Hasl + gold finger5). 30 microinch(") hard gold, edge bevelled. 6). Contour: cnc rout

We are offering impedance controlled printed circuit board. bicheng provides impedance controlled pcb's for r&d, high-tech, it research companies and organizations, large or small. technical parameters *controlled dielectric *controlled impedance *design coupons *test coupons *polar cits500 *tolerance +/-10% *differential impedance *single end impedance actual pcb case it's a typical sample we offer for high power electronics: 230*230mm=1 pcb fr-4 tg170 4 layers 35 um copper each layer 2.4mm finished thick min.track/space: 4/4mil min.hole 0.25mm enig surface finish l1 and l4: track /space 5.1/6mil, 90+/-10% ohm differential impedance l1, l2 and l4, track /space 6.1/7.8mil, 100+/-10% ohm differential impedance related pcb products & services: *high tg 170 *high cti 600v *multi-layer *blind vias, half hole, via in pad, *countersunk hole *gold finger *bga, csp, qfn *enig, hasl, immersion silver, osp *prototype *mass production *moq: 1 pcb *door to door shipment.

We are offering rogers printed circuit board. Bicheng provides r&d, high-tech, it research companies and organizations large or small with high frequency rf/microwave pcb's. technical parameters: *npth and pth( 20 um) *thermal stress: 288c/10sec *permitivity: er2.1-10.0 *base copper: 0.5oz, 1oz *together with fr-4 combination *rogers multilayer pcb *immersion gold *immersion silver, hasl available substrates: ro4350b ro4003c tlx-8 (taconic) f4b woven glass-reinforced ptfe 4mil(0.1mm) 8mil (0.203mm) 20mil(0.5mm) 10mil(0.254mm) 12mil(0.3mm) 30mil(0.762mm) 13.3mil(0.338mm) 20mil(0.508mm) 40mil(1.0mm) 20mil (0.508mm) 32mil(0.813mm) 30mil(0.762mm) 60mil(1.524mm) 60mil(1.524mm) applications: amplifier combiner coupler mixer multiplexer power divider wifi, wimax, lte bands 3g and 4g antenna.

We are offering multilayer printed circuit board. bicheng provides multilayer pcb's for electronics manufacturers, r&d, high-tech and it research companies, large or small. material available *fr-4 normal tg *fr-4 tg170 *fr-4 high cti>600v *ro4350b *ro4003c dielectric material & stack up requirement fr-4(no copper): 0.05-3.2mm for option prepreg type: 7628h(7630), 7628(43%), 7628(41%), 2116hr, 2116, 2113, 1080 and 1060 for option copper weight: 17-175um for option technical & services *4-32 layer count *0.5-6.0mm thick *impedance control *blind vias, via in pad, * gold finger *bga, csp, qfn *rogers+fr4 combination *enig, hasl, immersion silver *prototype *mass production *door to door shipment applications laptop computer server dram module television game player set-top-box wireless phone communication device automotive electronics etc.

We bicheng provides high tg printed circuit board for electronics manufacturers, electronics industry, r&d, high-tech and it research companies, large or small. material branditeq: it-180atc laminate, it-180abs prepreg shengyi: s1170 laminate, s0701 prepregrogers: ro4350b, ro4003c applicationsmultilayer and high layer, heavy copper applications, computer and peripherals, automobilebackplanes, servers and networking, telecommunications, remote broadcastdata storage, ip codecs, nata technics and services*1-32 layer count *0.5-6.0mm thick *impedance control *blind vias, via in pad, *gold finger *bga, csp, qfn *rogers+fr4 combination *enig, hasl, immersion silver*prototype *mass production *door to door shipment.

We offer Via in Pad Pcb.1). 80 *190mm/2up, fr-42). 6 layers at 1.4mm thick3). 35 m copper weight4). Green solder mask lpi/white legend5). Enig surface finish6). Blind via from layer 1 to layer 27). Via in pad plugged conductive resin

We are offering save tooling cost printed circuit boards (pcb). 1). 14 different pcb's in one panel within 400 x 500mm2). Same material and thickness. 2). Fr-4 material, double sided. 3). 1 oz copper weight, 1.6mm thick. 4). Green solder mask /white silkscreen5). Hot air level finish.

We are offering quick turn printed circuit boards (pcb). 1). Size: 45*140mm/1 up 2). Layer count: 2 layer, 20 m pth3). Thickness: 1.6mm +/- 10%4). Copper weight(finished): 35 m5). Smobc: lpi green solder mask/ white legend6). Holes: 0.4mm minimum, 4/4 mil track/space7). Pads finish: hasl 8). Fastest delivery time (calendar day)2 layer -- 1 days4 layer -- 3 days6 layer -- 5 days8 layer -- 5 days10 layer -- 7 days12 layer -- 10 days14 layer -- 12 days16 layer -- 12 days.

We are offering high tg printed circuit boards (pcb). 1). 90*90mm/1up, iteq it180a, fr-4 tg1702). 10 layer, 1.6mm thick3). 35 m copper finished4). Lpi green solder mask/ white legend5). Immersion gold (enig)6). Differential impedance control 90 ohm/100 ohm +/-10% on track 0.1mm7). Good for high-count layer pcb, widely used in computer, communication equipment, precise apparatus and instrument, router, and etc.

1). 177 x 75mm (2UP), FR-4 Tg 1702). 1.6mm +/-10%, 6 layer3). Min. hole 0.15mm, 4/4 track/gap4). Finished copper weight inner/outer 1 oz5). Green solder mask/ White ident6). Immerstion gold.7). Fine pitch and micro BGA

1) 190*130mm/10up, FR-4, Tg 135, CTI 175-225V2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz4) Min. hole size: 0.3mm5) Min. track/space: 4/4 mils6) LPI Solder mask/White legend7) Fiducial mark, tooling strips, mounting holes8) Finish: immersion gold

1) 160*160mm, FR-4 CTI 600V2) 8 layer 3) Finished inner/outer: 35 m4) LPI Green mask/white silk5) Min hole 0.19mm, 5/3 track/gap6) 1.6mm +/-10% thick7) Immersiong gold over nickel8) High voltage, Hihg temperature, moisture envirionment.

1). 20*50mm/1up, 5mm thick2). FR-4 material, 35 m copper3). Green solder mask /white silk screen.4). Through hole, PTH5). Hot air level Pb free6). Application: motor, medical equipment, industrial products.

1). 230*230mm/1up, FR-4 Tg 1702). 4 layers, 35 m copper, 2.5mm thick3). Min.track/space: 4/4 mil4). Min. hole size: 0.25mm5). 50 ohm, 100+/-10% ohm differential /single impedance control 6). Immersion gold7). High power electronics

We are offering high density interconnect (hdi) printed circuit board (pcb). 1). 1+c+1 hdi, buried/blind l1-l5/l5-l8 vias. 2). Fr-4 material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and space5). Min.drill 0.1mm6). Green solder mask/ white silkscreen7). Immersion gold over nickel