Vosida Intelligent Co. Ltd.

Shenzhen, China

• MOQ 1 Set(s)

Offering 10layer multilayer pcb. 1. Multilayer telecommunication pcbs 2. Pcb assembly prototype and mp 3. 100% e-test and x-ray before shipment, 99. 9% qualified after test for all multilayer pcbs. 4. Competitive price and high quality pcb board and pcb assembly 5. 10 years pcb manufacturer and assembly pcba. 6. Bga planting and smd/dip assembly, 6smt lines and 40 engineers. 7. Components sourcing all from manufacturer like ti, atmel, philip, analog, st, microchip, murata, epcos, nichicon, vishay, yagoe, bonus. 100% qualified and trustful, all original and new according to customers' bom. 8. Welcome customers to visit us and coach our work layer: 10 layer visa: buried and blind visa material: fr4 tg170 thickness: 1. 6mm copper thickness: 35um mini hole: 0. 1mm mini width/space: 0. 15mm/0. 2mm testing points: 4000 solder mask: lpi green sick-screen: white function: telecommunication pcba finish: immersion tin

We are offering 8 layer high thick copper power board, multilayer pcb board cem 3 fr 4. Click to view full size photo! detailed product description 8 layer high thick copper power board, multilayer pcb cem-3 fr-4 circuit boards description: high thick copper power board number of layers :8 layer pcb board base material: cem-3 fr-4 copper thickness 1/2 oz min 4 oz max board thickness 0.2mm-3.20m (8mil-126mil) min. Hole size 0.20mm (10mil) min. Line width 0.075mm (3mil) min. Line spacing 0.075mm (3mil) surface finishing: hasl, hal pb free, hal, immersion gold, gold plating, immersion tin color: green, red, white, blue, yellow certifications: iso 9001:2008, iso 14001:2004, ul, rohs feature: 1. Our pcbs are used for wide range of electronic products like medical devices, cctv, power supply, gps, ups, set-top box, telecomunication, led, etc. 2. Provides oem services to all sorts of printed circuit board assembly as well as electronic encased products 3. Solder mask color: green / yellow / black / white / red / blue. 4. Board material type: fr-4, aluminium-backed board, halogen-free, lead-free compatible, high-tg, high cti, cem-1, cem-3, rogers and more 5. Compound material lamination: 2 to 12 layers 6.surface finished type: hasl, flash golds, enig, osp (lead freecompatible), carbon ink, peelable s/m, hasl (lead free), immersion silver/tin, gold finger plating, enig+gold finger plating, immersion silver+gold finger plating