Ziitek Electronic Materials & Technology Co., Ltd

Dongguan, China

• MOQ 10000 Piece(s)
• Continuos Use Temp-50 to 200℃
• Tensile Strength425 psi
• ColorVarious

• MOQ 10000 Piece(s)
• Thermal conductivity1.0 W/m-K
• ColorVarious
• Continuos Use Temp-50 to 200℃
• Tensile Strength425 psi

• MOQ 1000 Piece(s)
• Therma lconductivity (Z Axis Direction)10.0W/m-K
• Hardness85 Shore A

We are offering heat conductive interface materials. The tir™600-10 series products are high-performance and heat-conductive interface materials with the reasonable prices. They can be used in applications where no requirement for electric insulation is specified. The unique grain orientation and plate structure enable these products to adapt to different contact surfaces closely, and thus the maximized heat conduction function is attained. Features 》high thermal conductive of 10.0 wmk 》low thermal resistance applications 》power conversion equipment 》power supplies 》large telecommunications switching hardware 》notebook computers standard thicknesses: 0.004"(0.102mm) 0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.012"(0.304mm) 0.020"(0.508mm) consult the factory alternate thickness. Standard sizes: 18" x 18"(457mm x 457mm) 18" x 300'(457mm x 91.4m) individual die cut shapes can be supplied. Peressure sensitive adhesive: request adhesive on one side with "a1" suffix. Request adhesive on doule side with "a2" suffix. Insulation: request plastic on one side with "p1" suffix

• MOQ 100 piece
• Hardness50 Shore A
• Thermal Conductivity1.6 W/m-K

• MOQ 1000 Piece(s)
• Setting temperature70℃ for 5 minutes
• Thermal conductivity2.5 W/mK

we are offering low melting point thermal interface material.the tic™800a series is low melting point thermal interface material. At 50℃, the tic™800a series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.the tic™800a series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. The tic™800a series shows no thermal performance degradation after 1, 000 hours@130℃, or after 500 cycles, from -25℃ to 125℃.the material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. Features 0.020℃-in²w thermal resistance naturally tacky at room temperature, no adhesive required no heat sink preheating required applications high frequency microprocessors notebook and desktop pcs computer serves memory modules cache chips igbts standard thicknesses: 0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) consult the factory alternate thickness. Standard sizes: 9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121m) tic™800 series are supplied with a white release paper and a bottom liner. Tic™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes. Peressure sensitive adhesive: peressure sensitive adhesive is not applicable for tic™800 series products. Reinforcement: no reinforcement is necessary.

• MOQ 1000 Piece(s)

we are offering thermally conductive interface material.the tic™800a series is low melting point thermal interface material. At 50℃, the tic™800a series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.the tic™800a series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance. The tic™800a series shows no thermal performance degradation after 1, 000 hours@130℃, or after 500 cycles, from -25℃ to 125℃.the material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures. Features 0.020℃-in²w thermal resistance naturally tacky at room temperature, no adhesive required no heat sink preheating required applications high frequency microprocessors notebook and desktop pcs computer serves memory modules cache chips igbts standard thicknesses: 0.003"(0.076mm) 0.005"(0.127mm) 0.008"(0.203mm) 0.010"(0.254mm) consult the factory alternate thickness. Standard sizes: 9" x 18"(228mm x 457mm) 9" x 400'(228mm x 121m) tic™800 series are supplied with a white release paper and a bottom liner. Tic™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes. Peressure sensitive adhesive: peressure sensitive adhesive is not applicable for tic™800 series products. Reinforcement: no reinforcement is necessary.

• MOQ 10000 Piece(s)
• ColorBlue

We are offering thermally conductive gap filler. The tif100 series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire pcb, which in effect enhances the efficiency and life-time of the heat-generating electronic components. Features good thermal conductive: 1.5 wmk naturally tacky needing no further adhesive coating soft and compressible for low stress applications available in varies thickness applications cooling components to the chassis of frame high speed mass storage drives heat sinking housing at led-lit blu in lcd led tv and led-lit lamps rdram memory modules micro heat pipe thermal solutions automotive engine control units telecommunication hardware handheld portable electronics semiconductor automated test equipment (ate) standard thicknesses: 0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm) consult the factory alternate thickness. Tif� series individual die cut shapes can be supplied. peressure sensitive adhesive: request adhesive on one side with "a1" suffix. Request adhesive on double side with "a2" suffix.

• MOQ 100 Kilogram
• thermal conductivity2.5W/mK

We are offering thermally conductive engineering plastic. Tcp100-25-06a is a thermally conductive engineering plastic developed for the housing design which requires high thermally conductivity and reduces the weight more than 30% comparing with the same aluminium devices. Application tcp100-25-06a can be used in applications such as heat sinking housing at led-lit blu in lcdled tv and led-lit lamps such as mr16. Also it can replace the normal aluminum heat sink. Features good thermal conductivity: 2.5wmk excellent thermal conductivity compared to normal engineering plastics lighter than normal aluminum housing 30% in weight excellent mould ability in injection moulding much higher production yield than normal aluminum die casting excellent flexibility in designing final products such as housings. Ul94 v-0 (ready).