Expert Laptop Service Center

GTB Nagar, Delhi

• Feature.Choose imported high - precision materials (temperature sensor, PLC, heater) to control the BGA disordering & soldering procedures precisely.

Since the mainstream of the new ICs chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

• FeatureTop & bottom heating can be controlled independently by the temperature graphs. A cross - flow fan cools rapidly to protect the PCB from deformation when welding.

Since the mainstream of the new IC’s chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

• FeatureThis machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and proprietary software attached to it.

Advance BGA Machine suppliers Company in Delhi India. Since the mainstream of the new IC's chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, Bga reballing machine.BGA package's soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced.BGA MACHINE suppliers Company in Delhi India. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

• Feature.Choose imported high - precision thermocouple to detect the top/bottom temperature precisely.

Since the mainstream of the new ICs chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.

• FeatureThis machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and proprietary software attached to it.

Since the mainstream of the new ICs chip package is shifting to BGA package from CBGA, CCGA, CSP, QFN, MLF, it becomes more difficult to do rework or repair on defective devices. Compared to said old type packages, BGA package’s soldering points, a large number of solder balls, located under the bottom of the package and it hinders visual inspection as well a touch up rework. The only possible way to reworkrepair already processed BGA package on board is detaching it from board. However, once it is removed from the board then it solder balls are damaged and cannot be used unless damaged balls are replaced. Expert Institute offers all the necessary processes from detaching to testing to make BGA package with damaged solder ball reusable and as reliable as new one. We are the authorized distributor for BGA MACHINE.