Other Products / Services #4727093

Roller Tinning Salt is a highly active, water soluble, granular, acidic salt, specially formulated for roll tinning applications. The tinning of the PCB is accomplished by the transfer of solder from a metallic roller, that is partially immersed in a bath of solder, with a pressure roller ensuring contact of the circuit surface with tinned metallic roller. Tinning salt is added to the molten solder very slowly. This is a non-spattering formulation which gives a bright solder finish and full coverage in a single pass.

Our solder and tin anodes are processed for high density and fine grain structure, and are the highest quality anodes available to the printed circuit board industry. These solders are designed and engineered to meet Indian, British, German, Japanese and American specifications. A unique processing method used in manufacturing these anodes eliminates oxide and non-metallic inclusions, and provides uniform plating without sludging and flaking.These solders can be used for general soldering applications as well as for critical microelectronic assemblies. They can be used in all types of automatic soldering machines, dip soldering equipment, tinning baths and all manual soldering processes. The anodes can be used to plate printed circuit board to extend the solderable shelf life and to use as an etch resist. They are also applicable for plating copper wire, bus bar as well as for plating terminals, eyelets and other electronic components. These solders and anodes are processed to assure fine grain structure and even dissolution during soldering or plating.

Our solder and tin anodes are processed for high density and fine grain structure, and are the highest quality anodes available to the printed circuit board industry. These solders are designed and engineered to meet Indian, British, German, Japanese and American specifications. A unique processing method used in manufacturing these anodes eliminates oxide and non-metallic inclusions, and provides uniform plating without sludging and flaking.

These solders can be used for general soldering applications as well as for critical microelectronic assemblies. They can be used in all types of automatic soldering machines, dip soldering equipment, tinning baths and all manual soldering processes. The anodes can be used to plate printed circuit board to extend the solderable shelf life and to use as an etch resist. They are also applicable for plating copper wire, bus bar as well as for plating terminals, eyelets and other electronic components. These solders and anodes are processed to assure fine grain structure and even dissolution during soldering or plating.