INNOVATIVE GROWTH ENTERPRISES

Gill Road, Ludhiana, Punjab

The unique combination of excellent electrical insulation and thermal conductivity makes BN very useful as a heat sink in high power electronic applications. Its properties compare favorably with beryllium oxide, aluminum oxide and other electronic packaging materials, yet is easier to form and finish.

High Temperature Environments.

Temperature stability and excellent resistance to thermal shock makes BN the material of choice in the toughest high temperature environments such as equipment for plasma arc welding, diffusion source wafers, and semiconductor crystal growth equipment & processing.

Molten Metal Handling

BN is inorganic, inert, nonreactive with halide salts and reagents, and is not wet by most molten metals and slags. These characteristics, combined with low thermal expansion, make it ideal for interface materials used in various molten metal processes.

HBC & HBT

• High purity hot pressed boron nitrides
• Diffusion bonded (no binder)
• Low dielectric constant & loss tangent
• Minimal moisture pick-up
• Chemically purified (HBC)
• Thermally purified (HBT)

HBN

• Boric oxide binder
• Highest density
• Highest strength

HBR

• Calcium borate binder
• High density
• Best moisture resistance

Momentive Performance Materials boron nitride (BN) composites incorporate proprietary compositions with other refractory materials and are excellent candidates to consider for harsh environments such as non- ferrous molten metal applications.

Continuous casting is one of the most common metal manufacturing technologies. The liquid metal flows from a tundish into the mold, in which the strand shell is formed. The metal strand is then taken off continuously or intermittently, at a speed and solidification rate appropriate to the particular alloy.

The ceramic break ring or the nozzle comes into contact with both the melt and the solidified alloy, and must satisfy correspondingly strict requirements:

• Chemical resistance to the solidified metal, i.e. no contamination of the alloy
• Good sliding properties, i.e. does not stick to the alloy
• High thermal shock resistance
• Defined thermal conductivity
• High wear resistance
• Easy to machine

Boron Nitride Rings are extensively used in the Industry. Momentive offers a group of different boron nitride materials and boron nitride composites that are matched to different metal alloys. From these materials, manufacture nozzles or break rings that increase the lifetimes for the following metals:

• Steels of all kinds
• Copper alloys
• Nickel alloys
• Superalloys

Additional Information:

• Delivery Time: 90-120 days

PBN/PG "printed circuit" heaters utilize PBN as an insulating substrate and PG as the resistive element. In non-oxidizing environments, this combination of unique materials delivers performance advantages not available in conventional thermal systems.

• Superior performance in ultra high vacuum.
• Unaffected by most molten metals.
• Operating temperatures to 1500C and higher.
• Long life, dimensionally and electrically stable.
• Chemically inert to most corrosive gases, liquids.
• High resistance for low cost power supplies.
• Mechanically durable, thermally shock resistant.
• Tailored thermal gradients for specific requirements.
• Ultra-fast response, low thermal mass.
• Power outputs to 35 watts/cm2 (225 watts/in2) and higher.
• Dielectric, fully dense, ceramic surface.
• Often suitable for slightly oxidizing atmospheres.

Potential applications for pyrolytic boron nitride include:

• Compound semiconductor crystal growth
• Wafer processing
• Electronic assembly
• Metallurgical applications
• Thin film manufacturing