Other Products / Services #336756

Product Description:Phosphorous Copper Balls (Cu-DHP) finds usage in the plating of Printed Circuit Boards. These balls are available in Copper Ingots, Copper Cathodes and Electrolytic Copper options with all copper forms containing in it least 99.9% copper. Free from impurities, these provide the safeguard from contamination of electroplating solutions as well as a Co deposit on the cathode. Further, these are also available in suitable metallurgical condition to dissolve uniformly.General Specifications: Size - Oval - 80mm x 30mm; Ball minuscule 25mm, minuscule 38mm, minuscule 50mm or as per customer requirement Material Standard- ASTM B265, Grade 5, Grade 9 Shape- Oval, Ball Weight - per foot Application Areas: Electroplating Applications Rotogravure Electroforming Decorative Printed Circuitry Electrical Ground Rod Electro-forming Other functional plating applications.   Jans Copper Pvt Ltd is one of the leading Copper Ballss, Copper Balls & Copper Nuggets manufacturer and supplier in India. Jans Copper Pvt Ltd's Copper Ballss, Copper Balls & Copper Nuggets are manufactured in accordance with the defined international standards. The raw material that is used to manufacture SIMCO copper products are LME grade ‘A’ cathodes of purity greater than 99.99% copper resulting in higher conductivity, crack free extrusion, excellent finish and longer life.   Available Sizes As per customer’s requirement Available Grades ETP, OFC, Phosphorised Copper Plating / Coating Bare Additional Specifications / Details Available in all forms i.e. Oval,  Slabs,  Balls,  Rods, Nuggets, etc. Applications / Uses Printed circuit boards, Rotogravure, Electroforming, etc. Application Areas: Electroplating Applications Rotogravure Electroforming Decorative Printed Circuitry Electrical Ground Rod Electro-forming Other functional plating applications Product Description:Phosphorous Copper Balls (Cu-DHP) finds usage in the plating of Printed Circuit Boards. These ballss are available in Copper Ingots, Copper Cathodes and Electrolytic Copper options with all copper forms containing in it least 99.9% copper. Free from impurities, these provide the safeguard from contamination of electroplating solutions as well as a Co deposit on the cathode. Further, these are also available in suitable metallurgical condition to dissolve uniformly.General Specifications: Size - Oval - 80mm x 30mm; Ball minuscule 25mm, minuscule 38mm, minuscule 50mm or as per customer requirement Material Standard- ASTM B265, Grade 5, Grade 9 Shape- Oval, Ball Weight - per foot Application Areas: Electroplating Applications Rotogravure Electroforming Decorative Printed Circuitry Electrical Ground Rod Electro-forming Other functional plating applications   Substance resulting from metallurgic processing of primary sources (copper matte obtained from copper ore/concentrate) and/or secondary sources (copper scrap and/or black copper) and including recycled intermediates (i.e. spent balls and removal cathodes).  Composed primarily of copper metal and copper oxides (> 80%) and containing other residual metals and their compounds. The raw material for a copper balls comes from one of two places; the copper is either refined or scrap material. Refined copper comes in the form of a copper cathode, named so because copper is electrolytically refined (plated out of solution). In this process, blister copper (approximately 95% copper) is dissolved anodically and high purity copper metal is plated slowly on a cathode with the impurities falling to the bottom of the plating tank as sludge. The impurities in the sludge include iron, sulfur, tellurium, selenium, gold, silver, zinc, arsenic, and others. The resulting cathode is 99.95% pure copper and can now be melted to form ballss. Scrap copper is generated daily around the world from such sources as utility wires, telephone wires, transformers, water tubes, buss bars, and other sources. This material is usually grouped and sorted by a scrap dealer. The disadvantage of scrap metal is its potential for contamination. All of the previously mentioned sources contain steel, tin, silver, and/or lead. The metals can also be mixed when sorting, and copper alloys can be mistaken for pure copper. Some metallic impurities in copper ballss can be dissolved and plated. These dissolved impurities will increase in concentration over time, resulting in a bath saturated with metallic contaminants. Plated impurities can cause stress and roughness on the plated part, which, in turn, cause difficulties in plating and process control, higher additive consumption (brightener) and scrap parts. These impurities usually go undetected until production problems appear because they are not normally examined in routine analysis. Grain Structure. The grain structure is the most important characteristic of copper ballss; this structure is completely determined by the process used to manufacture the ballss, which we will now explore. Casting of copper ballss is the simplest and least costly method; however, cast copper ballss do not exhibit the fine, uniform grain structures necessary for superior plating. Higher casting speeds will increase production and reduce costs, but will also result in larger grain size, and, therefore, inferior grain structure. Treatment is required subsequent to casting in order to produce copper ballss with a fine grain structure. This usually involves hot rolling, hot extruding, or hot forging. When the copper is formed under high temperature and pressure the grain structure is reformed and becomes fine and uniform. It should be noted that copper used for a variety of functions, other than ballss, require fine grain structures (wire, buss bars, copper foil and sheets). Overall, copper ballss containing higher impurities and without a fine grain structure will dissolve unevenly, have a higher sludge yield, result in lost copper dropping into solution, and have the potential to increase the roughness of plated parts. The results below show the sludge weight left in solution after 30 minutes of plating at 15ASF with four different types of copper balls balls. Filtered Solution (Weight of Sludge).      Phosphorus content. Phosphorus content for acid copper plating is ideally maintained between 0.040 and 0.065%. Metallurgically, impurities are located at grain boundaries. Therefore, phosphorus (required for acid copper plating) is most evenly distributed in fine grain ballss. Typically, a black film develops as a result of the phosphorus in the balls. This film keeps fine pieces of copper from falling off of the balls as sludge and also retards corrosion of the balls. Ballss with large grain structures will develop a black film, but this film will not be adherent and quickly turn into sludge. The sludge now contains usable copper (lost metal) that can plug up balls bags and fall into solution causing roughness on plated parts. Cleanliness. Manufacturing oils, oxidation, and burrs must be removed from copper ballss. Copper oxidizes when it freezes from the molten state or when heated for rolling, forging, or extruding. This oxidation must be removed either by mechanical abrasion or acid pickling followed by neutralization. Mechanical methods are preferred because there is no residue. In the manufacture of bar ballss sawing, drilling, and tapping oils are used to lubricate the tooling. The oils are applied to the copper as well as the tooling. Proper washing and rinsing removes these residual oils or coolants (organic compounds) which would contaminate the plating bath. Balls nuggets are typically made by cutting copper rod into various lengths. This shearing process creates burrs and sharp edges that can drop into tanks or cause the nuggets to bridge or nest in titanium mesh baskets, causing voids of balls, uneven plating distribution, and balls polarization. In addition, burrs and sharp edges are hazards to the operators handling the material. Ballss should be inspected carefully to determine that the material has come from the manufacturer ready for use with no pretreatment necessary.   Copper balls are formed by either cold forging (heading) or hot roll forging copper rod of various thickness. Copper wire being headed should preferably already have a fine grain structure. Normally copper balls that are hot roll forged will have a post-treatment procedure to ensure they will have a fine grain structure.       Overall, there are several characteristics that determine the quality of the copper anodes manufacturing process. These include: purity of copper, fine grain structure, uniform phosphorus content and distribution, and properly cleaned and anodes packaged and ready for use. Therefore, the quality of copper anodes should be very important to electroplaters because properly manufactured anodes will: extend bath life; have less metallic contamination; produce parts without roughness; have less sludge; and require less maintenance.

Application Areas:

• Bus Bars
• Transformer Connectors
• Earthing Protection in L.T. and H.T. Electrical Panels
• Power Transmission equipment
• Control Panels

Our super flexible flat copper braids (copper tapes) are made to order from 0.05 mm diameter wire are braided into a tube followed by a rolling process to flatten them to the specified width and thickness.They are used as earthing straps and in numerous electrical components.These super flexible flat copper braids can be made in electrolytic copper Cu-ETP (grade C101) oroxygen free copperand in a wide range offinishes. Tin plated super flexible copper braid is made from 0.071 mm dia wire. The braid can be folded back on itself, as shown in the pacture.All our copper braids areRoHS compliant.

Application Areas: Switch Gear industries Power plants Cathodic Protection Bus Ducts Transformer V.C.B. Resistance welding engineering Electric Locomotives Galvano Engineering Furnace Copper, which has chemical symbol as Cu and atomic weight 29, is the most widely used metal in electrical and Manufacturing industry. Electronics component such as integrated circuits, electro-magnets and printed circuit boards are created using copper and products related to copper. Electrical Connectors use the mechanical assembly to connect or join electrical circuits to be used as an interface. Due to the nature of operation, an electrical connector needs to be manufactured using precise configuration and calculations. Copper wires are the most widely used metals for creating electrical conductors. Copper, has the maximum electrical conductivity and thermal conductivity which makes them as an ideal material for Manufacturing electrical connectors. Braided flexible connectors and jumpers are important components of electronics industry. These are manufactured using copper as well as stainless steel bellows, which are sometimes covered to provide additional strength and support. The main purpose of braided flexible connectors is to deliver maximum power output, even during peak performance. In those sectors, where the demand of power is much, and the wires experience considerable load, then braided flexible connectors can be an efficient solution for optimal power output. Some of the advantages of using braided flexible connectors are: ·         Control and absorb the vibrations ·         Manage the natural expansion and compression of wires during power transmission ·         Provide minimum resistance for seamless productivity Braids made of many copper wires are also sometimes used for flexible electrical connections between large components. The numerous smaller wires comprising the braid are much more resistant to breaking under repeated motion and vibration than is a cable of larger wires. In electrical and electronic cables, braid is a tubular sheath made of braided strands of metal placed around a central cable for shielding against electromagnetic interference. The braid is grounded while the central conductor or conductors carry the signal. - High conductivity copper - Wire to Bs - 4109 - C101 - Suitable for Earth Bonding/ also supplied as Standard Drilled & Pre-Cut Bonds. - Customer specific sizes & types of braid can be manufactured on order. Even though many of our products are standard items, we also make special tailor made products made exactly to the requirements of our customers.   Electrical engineers in power generation are aware of this simple fact: Vibration is an enemy of electrical connectivity.  

Application Areas: Electroplating Applications Rotogravure Electroforming Decorative Printed Circuitry Electrical Ground Rod Electro-forming Other functional plating applications Product Description:Phosphorous Copper Anode (Cu-DHP) finds usage in the plating of Printed Circuit Boards. These anodes are available in Copper Ingots, Copper Cathodes and Electrolytic Copper options with all copper forms containing in it least 99.9% copper. Free from impurities, these provide the safeguard from contamination of electroplating solutions as well as a Co deposit on the cathode. Further, these are also available in suitable metallurgical condition to dissolve uniformly.General Specifications: Size - Oval - 80mm x 30mm; Ball minuscule 25mm, minuscule 38mm, minuscule 50mm or as per customer requirement Material Standard- ASTM B265, Grade 5, Grade 9 Shape- Oval, Ball Weight - per foot Application Areas: Electroplating Applications Rotogravure Electroforming Decorative Printed Circuitry Electrical Ground Rod Electro-forming Other functional plating applications   Substance resulting from metallurgic processing of primary sources (copper matte obtained from copper ore/concentrate) and/or secondary sources (copper scrap and/or black copper) and including recycled intermediates (i.e. spent anodes and removal cathodes).  Composed primarily of copper metal and copper oxides (> 80%) and containing other residual metals and their compounds. The raw material for a copper anode comes from one of two places; the copper is either refined or scrap material. Refined copper comes in the form of a copper cathode, named so because copper is electrolytically refined (plated out of solution). In this process, blister copper (approximately 95% copper) is dissolved anodically and high purity copper metal is plated slowly on a cathode with the impurities falling to the bottom of the plating tank as sludge. The impurities in the sludge include iron, sulfur, tellurium, selenium, gold, silver, zinc, arsenic, and others. The resulting cathode is 99.95% pure copper and can now be melted to form anodes. Scrap copper is generated daily around the world from such sources as utility wires, telephone wires, transformers, water tubes, buss bars, and other sources. This material is usually grouped and sorted by a scrap dealer. The disadvantage of scrap metal is its potential for contamination. All of the previously mentioned sources contain steel, tin, silver, and/or lead. The metals can also be mixed when sorting, and copper alloys can be mistaken for pure copper. Some metallic impurities in copper anodes can be dissolved and plated. These dissolved impurities will increase in concentration over time, resulting in a bath saturated with metallic contaminants. Plated impurities can cause stress and roughness on the plated part, which, in turn, cause difficulties in plating and process control, higher additive consumption (brightener) and scrap parts. These impurities usually go undetected until production problems appear because they are not normally examined in routine analysis.Grain Structure. The grain structure is the most important characteristic of copper anodes; this structure is completely determined by the process used to manufacture the anodes, which we will now explore. Casting of copper anodes is the simplest and least costly method; however, cast copper anodes do not exhibit the fine, uniform grain structures necessary for superior plating. Higher casting speeds will increase production and reduce costs, but will also result in larger grain size, and, therefore, inferior grain structure. Treatment is required subsequent to casting in order to produce copper anodes with a fine grain structure. This usually involves hot rolling, hot extruding, or hot forging. When the copper is formed under high temperature and pressure the grain structure is reformed and becomes fine and uniform. It should be noted that copper used for a variety of functions, other than anodes, require fine grain structures (wire, buss bars, copper foil and sheets). Overall, copper anodes containing higher impurities and without a fine grain structure will dissolve unevenly, have a higher sludge yield, result in lost copper dropping into solution, and have the potential to increase the roughness of plated parts. The results below show the sludge weight left in solution after 30 minutes of plating at 15ASF with four different types of copper anode balls. Filtered Solution (Weight of Sludge).    Phosphorus content. Phosphorus content for acid copper plating is ideally maintained between 0.040 and 0.065%. Metallurgically, impurities are located at grain boundaries. Therefore, phosphorus (required for acid copper plating) is most evenly distributed in fine grain anodes. Typically, a black film develops as a result of the phosphorus in the anode. This film keeps fine pieces of copper from falling off of the anode as sludge and also retards corrosion of the anode. Anodes with large grain structures will develop a black film, but this film will not be adherent and quickly turn into sludge. The sludge now contains usable copper (lost metal) that can plug up anode bags and fall into solution causing roughness on plated parts.Cleanliness. Manufacturing oils, oxidation, and burrs must be removed from copper anodes. Copper oxidizes when it freezes from the molten state or when heated for rolling, forging, or extruding. This oxidation must be removed either by mechanical abrasion or acid pickling followed by neutralization. Mechanical methods are preferred because there is no residue. In the manufacture of bar anodes sawing, drilling, and tapping oils are used to lubricate the tooling. The oils are applied to the copper as well as the tooling. Proper washing and rinsing removes these residual oils or coolants (organic compounds) which would contaminate the plating bath. Anode nuggets are typically made by cutting copper rod into various lengths. This shearing process creates burrs and sharp edges that can drop into tanks or cause the nuggets to bridge or nest in titanium mesh baskets, causing voids of anode, uneven plating distribution, and anode polarization. In addition, burrs and sharp edges are hazards to the operators handling the material. Anodes should be inspected carefully to determine that the material has come from the manufacturer ready for use with no pretreatment necessary. Anode balls are formed by either cold forging (heading) or hot roll forging copper rod of various thickness. Copper wire being headed should preferably already have a fine grain structure. Normally copper balls that are hot roll forged will have a post-treatment procedure to ensure they will have a fine grain structure.

Copper and aluminum foils are used as current collectors at the anode and cathode side. Both materials are highly stable with melting points >600C (Table 7B.4). Accordingly, the current collectors do not contribute to the initiation of thethermal runawayof a cell, but at higher temperatures (>700C) a thermite-style reaction between the Al and metal oxide of the cathode is in discussion. In the case of thecopper foil, corrosion can lead to an internal short circuit caused by growing copper dendrites on the anode during deep discharge.Most stencils are fabricated from stainless steel, nickel, orcopper foil210-mils thick. Apertures are formed in the foil by one of three processes: chemical etching, laser cutting, or electroforming. Chemical etching, although the least costly of the three methods, provides the coarsest features. In chemical etching the apertures, the metal foil is coated on both sides with a photosensitive coating, exposed to UV light through a mask that has the desired aperture pattern, and developed. The part is then immersed or sprayed with a chemical etchant that removes metal only in the unprotected areas, after which the photocured coating is removed. With the trend toward finer pitch devices (less than 20-mil pitch), both laser-cut and electroformed stencils must be used. Laser-cut stencils can be produced directly from Gerber data by computer numerically controlled laser cutting. Aperture dimension tolerances of 5m are reported.Chemically etched and laser-cut stencils are formed by subtractive processes. On the other hand, electroformed stencils are produced by an additive process in which a metal such as nickel is electroplated onto a mandrel that has a negative photoresist image of the aperture pattern. The electrodeposited nickel containing the apertures is then removed from the mandrel and used as the stencil. Because of their high precision patterns, electroformed stencils are used for ultra-fine pitch applications.In recent years, there has been increased interest in stencils produced from plastics such as acetal and polyethylene. The prime benefit in using plastic stencils is the thicknesses that can be used (greater than 1mm up to 8mm). By drilling apertures of various sizes, adhesive deposits of different heights ranging from 0.2 to 2mm wereprinted from a single screen thickness in one pass.Figure 4.4shows a typical range of dot heights that were produced from a 1-mm-thick plastic stencil having aperture sizes from 0.6 to 2mm.By carefully controlling the aperture size, it is possible to produce heights for every component type with a single squeegee stroke across a printed-circuit boardCopper is an influential metal for both industrial and consumer applications. Our copper foil inventory consists of Electro Tough Pitch (110 alloy) and Oxygen Free (102 alloy). We also have copper foil sheeting and other copper foil sheet products that are Hot Tin Dipped to enhance solderability.Copper is a versatile metal used in a variety of industries. Major characteristics include being a malleable and ductile metal with a very high thermal and electrical conductivity.Copper foil is available in Alloys 110 and 102. Upon request, other alloys are also available. Its many applications include: roofing, structural engineering, EMI/RFI shielding, circuit boards, and heat exchanging. These copper coils can be supplied on fiber, aluminum, steel, and plastic cores with inner diameters up to 20. Available tempers include annealed, full hard, and as-rolled.

Application Areas: Bus Bars Transformer Connectors Earthing Protection in L.T. and H.T. Electrical Panels Power Transmission equipment Control Panels Thickness 1mm To 60mm Standard IS Brand Name Jans Copper Width 5mm to 350mm Edge Type Radius Corner Edge, Square Edge, Full Radius Edge Application Medical, Automotive Industries, Power Distribution, Telecommunication Edge Length Up to 6400mm (21`) Uses Bus Bars, Transformer Connectors, Power Transmission equipment, Control Panels Standard overall cutting tolerance 100mm Copper percentage 99.99 Additional Information Min. Order Quantity 100 Kilogram  

Product Description:Phosphorous Copper Anode (Cu-DHP) finds usage in the plating of Printed Circuit Boards. These anodes are available in Copper Ingots, Copper Cathodes and Electrolytic Copper options with all copper forms containing in it least 99.9% copper. Free from impurities, these provide the safeguard from contamination of electroplating solutions as well as a Co deposit on the cathode. Further, these are also available in suitable metallurgical condition to dissolve uniformly.General Specifications: Size - Oval - 80mm x 30mm; Ball minuscule 25mm, minuscule 38mm, minuscule 50mm or as per customer requirement Material Standard- ASTM B265, Grade 5, Grade 9 Shape- Oval, Ball Weight - per foot Application Areas: Electroplating Applications Rotogravure Electroforming Decorative Printed Circuitry Electrical Ground Rod Electro-forming Other functional plating applications.   Jans Copper Pvt Ltd is one of the leading Copper Anodes, Copper Balls & Copper Nuggets manufacturer and supplier in India. Jans Copper Pvt Ltd's Copper Anodes, Copper Balls & Copper Nuggets are manufactured in accordance with the defined international standards. The raw material that is used to manufacture SIMCO copper products are LME grade ‘A’ cathodes of purity greater than 99.99% copper resulting in higher conductivity, crack free extrusion, excellent finish and longer life.   Available Sizes As per customer’s requirement Available Grades ETP, OFC, Phosphorised Copper Plating / Coating Bare Additional Specifications / Details Available in all forms i.e. Oval,  Slabs,  Balls,  Rods, Nuggets, etc. Applications / Uses Printed circuit boards, Rotogravure, Electroforming, etc. Overall, there are several characteristics that determine the quality of the copper anodes manufacturing process. These include: purity of copper, fine grain structure, uniform phosphorus content and distribution, and properly cleaned and anodes packaged and ready for use. Therefore, the quality of copper anodes should be very important to electroplaters because properly manufactured anodes will: extend bath life; have less metallic contamination; produce parts without roughness; have less sludge; and require less maintenance.  

Jans overseas presents a special range of flexible connectors in the market, which is widely acclaimed for its matchless quality. Braided flexible connectors are manufactured by us in compliance with the set industry standards while using the best materials sourced from trusted vendors. As a prominent flexible connectors manufacturer and exporter, we have gained appreciation from clients all over the world by supplying a range for diverse applications. Besides, we ensure to inspect every batch of the flexible connectors in terms of their appropriate design, us of best material and manufacturing techniques so theta the range is flawless in every aspect. our flexible copper connectors, braided flexible connectors etc combine maximum conductivity & minimum voltage drop, without the loss of flexibility in the braid. Our flexible connectors are available for quite competitive prices as well. We are one of the dependable flexible connectors exporters from india.

Forged copper clamp is a used as a replacement for brass contact pad as they are far superior and cost effective than the brass ones. Our forged copper clamps are leak proof and are free of blowholes. We are one of the superior forged clamp manufacturers and copper clamps exporters from india. Useful for various purposes, the forged copper clamps are made available by us in a variety of sizes. Accurate design, finely finished surface, high corrosion resistant abilities are some of the defining features of the forged copper clamp brought forth by us. Consequently, we have carved a niche amidst the major forged clamp manufacturers and exportersfrom india. general properties : material with minimum copper content of 99.9% as per is191. size : as per customer`s specifications. fields of application

• calcium carbide unit
• ferro alloys industries
• alloy steel plant

Committed towards satisfying our customers, we are involved in delivering quality Copper Casting. Our company has all the necessary logistic resources and connection to make on time delivery of order(s).