Kohesi Bond

Bhandup West, Mumbai, Maharashtra

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. TUF 1613 HT-CM offers an extensive serviceable temperature range of -70C to +200C. This product can withstand severe thermal cycling and shocks. Being a one component system. it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. TUF 1613 HT-CM is a 100% solids system i.e. it does not contain any solvents or diluents. In addition to superior electrical insulation, TUF 1613 HT-CM also offers very good thermal conductivity. It has a black color. It also extends phenomenal chemical resistance to a variety of acids, bases, fuels and water. TUF 1613 HT-CM although most commonly used for glop topping, its superior performance and the ability to pass NASA low outgassing standards, makes it suitable for use in various electronics, aerospace and vacuum applications. PRODUCT HIGHLIGHTSThermal conductivity; efficient heat transferSuperior electrical insulationRapid curesOutstanding dimensional stabilityCapable of passing NASA low outgassingUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding & Sealing, Coating, Potting, Glob Top, Die Attach Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi bond tuf 1613 ht-sm is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120c for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. Tuf 1613 ht-sm offers an extensive serviceable temperature range of -70c to +180c. This product can withstand severe thermal cycling and shocks. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides outstanding bonding and physical strength properties, as well as dimensional stability. Tuf 1613 ht-sm is a 100% solids and a reactive system i.e. It does not contain any solvents or diluents. In addition to superior electrical insulation, tuf 1613 ht-sm also offers very good thermal conductivity. It offers very smooth paste like consistency and does not tail when dispensed. It has a tan - brown color and it can be color matched to your specifications. With an ideal dispensing profile, tuf 1613 ht-sm although most commonly used for surface mount applications, its superior performance also makes it suitable for use in various other electronics, aerospace and distinctive oem applications. Product highlightsthermally conductivelow ionic contentextremely fast cureoutstanding dimensional stabilitysuperb electrical insulatorunlimited working life at room temperature typical applications : surface mount, bonding, sealing industrial certification : rohs compliant

Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 - 90 minutes at 120C and even faster at higher temperatures. TUF 1820 ANHT offers an across-the-board serviceable temperature range of 4K (-269.15C) to +200C. This product can withstand severe thermal cycling and shocks even at cryogenic temperatures. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides phenomenal bonding and physical strength properties, extremely low coefficient of thermal expansion and outstanding dimensional stability. TUF 1820 ANHT is a 100% solids and a reactive system i.e. it does not contain any solvents or diluents. It has a gray color and a smooth paste like consistency. It also extends first-rate chemical resistance to a variety of solvents, fuels and water. Owing to its heroic performance and ease of use, TUF 1820 ANHT is widely used in sophisticated electronics, optoelectronic, aerospace and specialty OEM applications. PRODUCT HIGHLIGHTSSensational thermal conductivityCryogenically serviceableSuperb mechanical strength propertiesOutstanding dimensional stabilityLow coefficient of thermal expansion (CTE)Unlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant

Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns. The efficiency heat transfer improves exceedingly with lower thermal resistance. This can be explained easily with the following formula: R = lK "R" is the thermal resistance; "l" is the adhesive layer thickness; "K" is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives (alumina filled) that are applicable in more than 50 micron thicknesses, offer a thermal resistance of 35 40 10-6 m2KW. Since TUF 1828 TC can be applied in 10 micron thick sections, it offers a notably low thermal resistance of 5 - 6 x 10-6 m2KW. TUF 1828 TC is cryogenically serviceable. Being a one component system, it provides ease of application and also adheres well to a wide variety of substrates including metals, ceramics, composites, most plastics and glass. It provides superior bonding and physical strength properties. It has a gray color. Owing to its sensational thermal management properties and low outgassing properties TUF 1828 TC is widely used in electronics, optical, aerospace, specialty OEM and cryogenic industries. PRODUCT HIGHLIGHTSUnrivaled heat transfer efficiencyCryogenically serviceableSuperb mechanical strength propertiesMicrons thin bond lines achievableCapable of passing NASA low outgassingUnlimited working life at room temperature TYPICAL APPLICATIONS : Bonding, Sealing

Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C 90C for 3 5 hours. KB 1031 ATFL-N can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15C) to +120C. It is an outstanding adhesive that offers superb physical strength properties and elongation, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1031 ATFL-N adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A and Part B have a nickel color. Owing to its versatile performance, KB 1031 ATFL-N is widely used in electronics, aerospace, electrical, semiconductor, microwave and various OEM applications. PRODUCT HIGHLIGHTSEasy mix ratio of 1:1 by weight or volumeOutstanding flexibilitySuperior thermal conductivityHigh peel strengthNickel filledelectrically conductiveCryogenically serviceable TYPICAL APPLICATIONS : Bonding, Sealing Industrial Certification : RoHS Compliant

Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. However, speedy cures are achievable with a straight heat cure as well at elevated temperatures. KB 1031 ATHT-LO can withstand severe thermal shocks and cycling. It offers an extensive serviceable temperature range of -70C to +180C. It is a phenomenal adhesive that offers outstanding physical strength properties and toughness, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1031 ATHT-LO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and dimensional stability, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a clear color and Part B has an amber color. Owing to its vacuum compatibility, KB 1031 ATHT-LO is widely used in electronics, aerospace, semiconductor and various OEM applications. PRODUCT HIGHLIGHTSConvenient 1:1 mix ratio by weightOutstanding mechanical strength profileSuperior dimensional stabilityHigh peel strengthExceptional electrical insulation propertiesCapable of passing NASA low outgassing TYPICAL APPLICATIONS : Bonding, Sealing, Coating Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working life. KB 1031 SPLV-6 readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. KB 1031 SPLV-6 offers an extensive serviceable temperature range of -50C to +120C. It is an outstanding adhesive that offers superb physical strength properties and bonds well to similar and dissimilar substrates with varying coefficients of thermal expansion. Among many others, KB 1031 SPLV-6 adheres well to metals, ceramics, composites, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils, acids and bases. Part A has a clear color and Part B has an amber clear color. Owing to its versatile performance and ease of use, KB 1031 SPLV-6 is widely used in electronics, aerospace, electrical, optical and various OEM applications. PRODUCT HIGHLIGHTSEasy mix ratio of 1:1 by weight or volumeLow exotherm; suitable for large castingsSuperb physical strength propertiesVery long working lifeStellar electrical insulation propertiesExcellent flow properties TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Encapsulating, Potting Industrial Certification : RoHS Compliant

Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 - 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90C for 3 - 5 hours. KB 1039 CRLP is specially formulated for use in cryogenic applications. It offers phenomenal resistance to cryogenic shocks and cycles down to 4K. Additionally it is optically clear and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. This product offers first-rate optical clarity and cures rigid. KB 1039 CRLP is widely used in optical, optoelectronic, electronics and aerospace industries, where optical clarity, low outgassing and cryogenic serviceability are key requirements. PRODUCT HIGHLIGHTSSuperior optical clarityVery good flow propertiesWithstands cryogenic shocks and cyclingOutstanding mechanical strength propertiesExcellent electrical insulation propertiesCapable of passing NASA low outgassing TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 4 - 5 hours and cures quickly at elevated temperatures. The optimal cure schedule is a room temperature set-up followed by a heat cure at 90C for 3 - 5 hours. KB 1039 CRLP-AO is specially formulated for use in cryogenic applications. It offers phenomenal resistance to cryogenic shocks and cycles down to 4K. Additionally it is thermally conductive and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition to superior electrical insulation, it also offers very good chemical resistance. Part A is black and Part B is off white in color. KB 1039 CRLP-AO is widely used in applications where thermal conductivity, low outgassing and cryogenic serviceability are key requirements. PRODUCT HIGHLIGHTSSuperior thermal conductivityVery good flow propertiesWithstands cryogenic shocks and cyclingOutstanding mechanical strength propertiesExcellent electrical insulation propertiesCapable of passing NASA low outgassing TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. Its stellar heat transfer capabilities and flow characteristics make it fitting for potting applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. KB 1040 AN-1 can withstand severe thermal cycling and provides superior physical strength properties and dimensional stability. It offers an extensive serviceable temperature range of -50C to +120C. KB 1040 AN-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has a gray color and Part B has a clear color. Owing to its remarkable performance and vacuum compatibility KB 1040 AN-1 is widely used in aerospace, electronics and related industries. PRODUCT HIGHLIGHTSSuperior thermal conductivityVery low coefficient of thermal expansionPhenomenal dimensional stabilityExcellent flow propertiesOutstanding electrical insulation propertiesCapable of passing NASA low outgassing TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 3 - 5 hours. However, speedy cures are achievable with a straight heat cure as well at elevated temperatures. KB 1040 CTE-LO can withstand extreme thermal environments down to cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15C) to +120C. It is a phenomenal adhesive that offers outstanding physical strength properties and dimensional stability. KB 1040 CTE-LO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, it also offers astounding chemical resistance to a variety of fuels, oils and water. Part A has an off-white color and Part B has a clear color. Owing to its vacuum compatibility and exorbitantly low CTE, KB 1040 CTE-LO is widely used in electronics, aerospace, optical, semiconductor and various OEM applications. PRODUCT HIGHLIGHTSVery high thermal conductivityLow coefficient of thermal expansionSuperior dimensional stabilityExcellent flow propertiesExceptional electrical insulation propertiesCapable of passing NASA low outgassing TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Encapsulation, Potting Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique quartz filled epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70C - 90C for 2 - 3 hours. KB 1040 QF being quartz filled, offers phenomenal dimensional stability and low coefficient of thermal expansion (CTE). Additionally, it is capable of passing NASA standards for low outgassing (ASTM E-595) test. It offers an extensive serviceable temperature range of -50C to +120C. This superior adhesive fosters outstanding physical strength properties and offers very low shrinkage upon cure. It offers very good flow properties. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils, acids, bases and water. Part A and Part B are beige in color. KB 1040 QF is widely used in optical, optoelectronic, fiber-optic, electronics, aerospace and related industries. PRODUCT HIGHLIGHTSExceptionally low shrinkage post curingCapable of passing NASA low outgassingSuperior dimensional stabilityOutstanding mechanical strength propertiesVery good electrical insulation propertiesExcellent flow properties TYPICAL APPLICATIONS : Bonding, Sealing, Coating, Potting, Encapsulation Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)

Kohesi bond tuf 1621 aoht is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing nasa standards for low outgassing (astm e-595) and has a convenient 1:1 (part a: part b) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70c - 90c for 3 - 5 hours. Tuf 1621 aoht is thermally conductive and it can withstand very high temperatures. It offers an extensive serviceable temperature range of -70c to +200c. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers exceptionally high lap shear strength (> 3, 300 psi). Tuf 1621 aoht adheres well to a wide variety of substrates including metals, ceramics, most plastics, rubbers and glass. In addition to superior electrical insulation, it also offers very good resistance to various chemicals, such as water, oils and fuels. Part a and part b are off-white in color. Tuf 1621 aoht is widely used in electronic, optoelectronic, vacuum, aerospace and related industries. Product highlightssuperior thermal conductivityexcellent toughnessconvenient 1:1 mix ratiofirst-rate thermal conductivityexceptional electrical insulation propertiescapable of passing nasa low outgassing typical applications : bonding, sealing, coating industrial certification : rohs compliant and nasa (low outgassing astm e-595)