Molex India Limited

Chennai, Tamil Nadu, India

HandyLink I/O Interconnect System

HandyLink I/O Interconnect System

The HandyLink interconnect product family from Molex includes a right-angle SMT receptacle, wire and PCB version plugs, perpendicular and parallel mounted cradle connectors for docking applications and a wide array of cable assemblies.

An innovative compression-style contact design provides long-term performance and reliability that supports mating cycles up to 15,000. The compact size and continuous current-carrying capability of 1.5 to 3.0A depending on circuit configuration, provides an optimal solution for the mobile device industry. The patented integrated-latch design provides optimal Electrostatic Discharge (ESD) protection and mechanical integrity.

  • Category : I/O Connectors
  • Features : Supports USB transmission speeds 500 ns rise time and 2 pF capacitance,Reduces real estate and minim
  • Current : 1.0A

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Contact Details

Jaijo Varghese

Ist floor, Origin ITFS Dr. V.S.I Estate, Phase II, Taramani, Chennai, Tamil Nadu - 600041, India

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