Addressing functionality, space, weight and cost concerns, Molex delivers MIDLDS 3-D selective trace solutions, providing engineering and manufacturing expertise to create customized, miniaturized connectors, antennas, sensors and more
MID (molded interconnect device) LDS (laser direct structuring) manufacturing technology offers the unique ability to solve these requirements due to its 3-D (3D) selective trace functionality, coupled with the flexibility of using injection molded plastics that can be soldered, plastic welded, insert molded, over-molded and wire bonded. OEMs can work concurrently with local Molex engineering teams in the design and development of any custom MIDLDS connector, antenna or sensor solution to provide a product that is optimized for a specific application.

Addressing functionality, space, weight and cost concerns, Molex delivers MIDLDS 3-D selective trace solutions, providing engineering and manufacturing expertise to create customized, miniaturized connectors, antennas, sensors and more
MID (molded interconnect device) LDS (laser direct structuring) manufacturing technology offers the unique ability to solve these requirements due to its 3-D (3D) selective trace functionality, coupled with the flexibility of using injection molded plastics that can be soldered, plastic welded, insert molded, over-molded and wire bonded. OEMs can work concurrently with local Molex engineering teams in the design and development of any custom MIDLDS connector, antenna or sensor solution to provide a product that is optimized for a specific application.