Multilayer Mixed Dielectric PCB

Custom Manufacturing of Multilayer Mixed Dielectric PCB for the AerospaceDefense Industry
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Beginning with Inventory, all the correct materials were pulled and checked against customer requirements and specifications.
Initially, all innerlayers were drilled, imaged, and etched. The innerlayers then proceeded to Lamination where they were pressed into panels using low Dk bonding films. After lamination and cool-down, the panels moved to drilling where all primary holes were drilled. To prepare the hole walls for Direct Metallization, the panels were processed through Plasma and Sodium etching.
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Multilayer Mixed Dielectric
After DMS, the outerlayers of the panels were imaged, copper plated, solder plated, and etched. Trace widths had to be controlled to +- .0005" to provide the end product with proper electrical characteristics. A Liquid Photoimageable (LPI) soldermask was applied, followed by a ENIG (Electroless Nickel Immersion Gold) final finish. Using a number of product evaluation techniques, including flying probe testing, we ensured that this PCB met with all client product requirements. The boards were vacuum packaged and shipped to their facility in Northeastern US.