Company Information
Member Since 1 Year
Nature of Business Manufacturer
GST No. 09AAFCH8113H1ZKAsk for more detail from the seller
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Functions
Vacuum reflow process is a kind of technology which makes the reflow soldering process in vacuum environment. In the vacuum environment, due to the pressure difference between inside and outside of the solder joint and maintaining a certain period of time, the bubbles in the solder joint are easy to overflow, the void rate of the solder joint is greatly reduced, and the combination of vacuum and reflux welding is realized.
Specification:
Model | TRV-800-N | TRV-1000-N | TRV-1200-N |
Dimension | 5520*1430*1530mm | 6300*1430*1530mm | 7050*1430*1530mm |
Electronic required | 3phase,380V 50HZ/60HZ | ||
Heating zones | Top8(1 IR)+Bottom7 | Top10(1 IR)+Bottom9 | Top12(1 IR)+Bottom11 |
Cooling zones | Top3+Bottom3 | ||
Vacuum pressure range | ≥5mbr | ||
Temp. range of hot air | Room temperature～350℃ | ||
Temp. range of vacuum chamber | Room temperature～280℃(optional:320℃) | ||
Conveyor | 300～1700mm/min | ||
PCB Height | PCB Top30mm/Bottom20mm | ||
L*W PCB size | L:min150mm,max300mm W:min100mm,max400mm | ||
Gas pressure | N2/0.4-0.6Mpa | ||
Model | TRV-800D-N | TRV-1000D-N | TRV-1200D-N |
Dimension | 5520*1660*1530mm | 6300*1660*1530mm | 7050*1660*1530mm |
Electronic required | 3phase,380V 50HZ/60HZ | ||
Heating zones | Top8(1 IR)+Bottom7 | Top10(1 IR)+Bottom9 | Top12(1 IR)+Bottom11 |
Cooling zones | Top3+Bottom3 | ||
Vacuum pressure range | ≥5mbr | ||
Temp. range of hot air | Room temperature～350℃ | ||
Temp. range of vacuum chamber | Room temperature～280℃(optional:320℃) | ||
Conveyor | 300～1700mm/min | ||
PCB Height | PCB Top30mm/Bottom20mm | ||
L*W PCB size | L:min150mm,max300mm W:Dual-Channel min100mm, parallel pass max250mm*2 | ||
Gas pressure | N2/0.4-0.6Mpa | ||
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Sector 83, Noida, Uttar Pradesh 
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