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Wafer Cutting Apparatus

Wafer Cutting Apparatus

Listing ID #4606848

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  • Supply Type Manufacturer, Exporter, Supplier
Preferred Buyer From : All over the world

The wire cutting machine "WCM" is manually operated and cuts wafer blocks to small wafer fingers of predetermined dimensions. The cutter frame and feed bar can be exchanged to produce other size of biscuits. The machine is used for cutting of small scale output.
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Company Information

R & D Engineers
Kukatpally, Hyderabad, Telangana
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  • Member Since 20 Years
  • Nature of Business Retailer
  • Year of Establishment 1991

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Technical Details WCM
Plate Size in mm 270 X 3750
Out put wafer sheets.hr Stack Height (mm) 10 to 70
Electric Heating: Connected load in KW Min. Cutting Wisth 16
Cream Filled wafers.Hour** (Kgs appx.) Cutting Wire Spring Steel in mm 0.5
Dimensions (approx.in mm)  
Length 1450
Width 1130
Height 675
Weight (approx) 110
Net 130
Gross 200
Shipping Volume(CBM) 1
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  • Seller R & D Engineers
  • Address Kukatpally, Hyderabad, Telangana
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