Our Products
We offer a complete product range of ZZT Dual Auger Glue Dispensing Valve - HUGE Series, ZZT Single Auger Glue Dispensing Valve - HUGE Series and Dispensing Valves
Production Introduction >> A05 Full Automation Visual Automation Integrated Automation In-line Automation Desktop Robot Desktop + Visual Integrated Desktop Integrated Desktop + Visual Dual Auger Valve >> Single Auger Valve >> Piezo Jet Valve >> Pneumatic Spray Valve >> With independent intellectual property rights of screw valve series, jet valve series, spray valve series, for different products, application scenarios to meet the diversity of solutions. The rubber valve has high precision, high efficiency, high life, a variety of colloid adaptation, a variety of viscosity adaptation, low failure, easy maintenance. The glue is stable, and the body material is corrosion-resistant. Equipped with independent intellectual property rights of the valve body control system. Ensure excellent glue effect. SPEN M30 SPEN 50 SPEN T50 SPEN B50 SPEN H50 SPEN S50 SPEN 500 SPEN M500 SPEN T500 SPEN D500 SPEN N500 ZJET 200 ZJET 201 ZHJET 200 ZJET 300 ZJET 301 ZHJET 300 SV 200 SV 201 SV 300 SV 301 Suitable for Single component: UV glue, red glue, solder paste, silicone gel, silicone oil, grease, instant drying glue, anaerobic glue, conductive glue, epoxy glue, Primer, loose heat silicone grease, thermal paste, bottom filling glue, three anti-paint, nano coating, etc. Two-component type: acrylic two-component glue, epoxy two-component glue, two-component thermal paste, etc. Hot melt adhesive: TPU hot melt adhesive, RUR hot melt adhesive, paraffin, etc.
Main Features
Scope of Application
Suitable for UV glue, sealing silicone, lubricating grease, conductive glue, epoxy glue, heat dissipation silicone grease and other types of single-component fluids.
Main Features
Scope of Application
Applicable to two-component fluids such as acrylic, epoxy, and thermal conductive paste; easily realize ceramic bonding, metal bonding, non-metal bonding, magnet bonding, sealing, thermal conductivity and other processes.