Our Products
Our product range contains a wide range of MANUAL WIRE BONDER MACHINE
The iBond5000 Series integrates the 4500 manual wire bonder mechanical design with an advanced graphical user interface. The iBond5000 Series includes 3 basic models: Wedge, Ball and Dual. The iBond5000-Ball is an advanced ball bonder used for process development production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every gold ball bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers and much more.