SKTECH ENTERPRISE LIMITED

Shenzhen, China

• MOQ 1 Piece(s)
• Base MaterialFR4
• Min. Line Width0.1mm
• Model NumberSKTECH-119
• Board Thickness1.6mm
• Copper Thickness1 OZ
• Country of OriginChina
• Brand NameSKTECH

Via in pad pcb with blue solder mask white legend and immersion gold surface , copper 1oz description of model number sktech-2120-b2: base material : fr4 halogen-free board thickness : 1.2mm solder mask: green surface finish : immersion gold number of milled slots: 0 number of internal cutouts: 0 impedance control no layer count �4 layers final foil external: 1oz final foil internal: 0.5oz with the development of electronic products to the light, thin and small, pcbs are also pushed into high density, high difficulty. Among them, via in pad is one of the topics that engineering designer can not avoid. It is a main part of multilayer pcb and directly helps to save pcb real estate up to 50% for fine pitch bga and flip chip components. The main difficulty for the plugged via is to prevent soldering tin into via or solder mask onto pads. The accumulation of years of manufacturing experience has given us a good control on the pcb quality. Pcb and service a) base material:fr-4 tg>135, high tg 170, high cti 600v b) material brand:iteq, shengyi c) multilayer lamintion:in house d) solder mask:green, blue, yellow, black, red and its relative matt color e) surface finish:hasl lead free, enig, immersion silver, immersion tin. F) via filling material:non-conductive epoxy resin g) via plugged:pad plugged flatly, good for next smt process h) product services:prototypes, small volume and large production i) freight services:door to door, to sea port, to airport service

• Min. Line Width0.1mm
• Copper Thickness1 OZ
• Base Material1.6MM
• Board Thickness1.6mm
• Country of OriginChina
• Brand NameSKTECH
• Model NumberSKTECH -118

Description of model number sktech-2120-b2: base material : fr4 halogen-free board thickness : 1.2mm solder mask: green surface finish : immersion gold number of milled slots: 0 number of internal cutouts: 0 impedance control no layer count �4 layers final foil external: 1oz final foil internal: 0.5oz with the development of electronic products to the light, thin and small, pcbs are also pushed into high density, high difficulty. Among them, via in pad is one of the topics that engineering designer can not avoid. It is a main part of multilayer pcb and directly helps to save pcb real estate up to 50% for fine pitch bga and flip chip components. The main difficulty for the plugged via is to prevent soldering tin into via or solder mask onto pads. The accumulation of years of manufacturing experience has given us a good control on the pcb quality. Pcb and service a) base material:fr-4 tg>135, high tg 170, high cti 600v b) material brand:iteq, shengyi c) multilayer lamintion:in house d) solder mask:green, blue, yellow, black, red and its relative matt color e) surface finish:hasl lead free, enig, immersion silver, immersion tin. F) via filling material:non-conductive epoxy resin g) via plugged:pad plugged flatly, good for next smt process h) product services:prototypes, small volume and large production i) freight services:door to door, to sea port, to airport service

• MOQ 1 Set(s)
• Brand NameSKTECH
• Model NumberSKTECH-120
• Country of OriginChina
• Number Of Flowerpunching tool

• MOQ 1 Set(s)
• Brand NameSKTECH
• Country of OriginChina
• Model NumberSKTECH -122
• Number Of Flowerpunching tool

• MOQ 1 Set(s)
• Brand NameSKTECH
• Model NumberSKTECH -121
• Country of OriginChina
• Number Of Flowerpunching tool