-
Heating Zone width
150 mm, 310 mm
-
LxWxH (mm)
18OO x 600 x 800
SLR Range of reflow soldering systems are the state-of-the-art soldering systems for SMD and hybrid PCB assemblies. SMD Components are soldered on the PCB by the reflow process: a process where desired amount of solder paste is applied to the PCB pads; SMD is gludedplaced on the pads and then this assembly is heated to a temperature slightly higher then the melting point of solder. The solder paste heats, melts and reflows forming a strong metallurgical joint. Heat is transfered to the PCB and SMD by rediation from a heat source that faces the PCB side to be soldered. Heat transfer by radiation is goverend by three parameters; Temperature of heat source, distance between the source (heater) and the sink (PCB) and the duration of expouser (inversely proportional to chain speed) All three parameters are infinitly controlable in this range of machines.The mid-zone then reflows the solder at 200-2400C and the solder bond is established. The PCB assembly now enters the dwell and controlled cooling zone of heater banks where the temperature of the PCB assembly is gradually brought down to 100-120C, avoding the thermal and mechanical stresses that might develop due to solidification of the solder and cooling of the PCB assembly.The system is suitable for soldering even fine print tracks upto 10 mils, without damage to the components and PCB of even FR-3-FR-4, grade, laminates.
Write a Review
Control Signals (Control Signals)
Flat No. 91, Pocket-N, Sector-1, DSIDC, Bawana Industrial Complex, Bawana, Delhi - 110039
Share us via
