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Memsstars Orbis dry release etch process tools are available using vapor Hydrogen Fluoride (HF) andXenon DiFluoride (XeF2) chemistries.

Available in variants Alpha, 1000 and 3000.

The new generation of ORBIS platforms enable the most advanced processing capability from research, to commercial R&D through to high-volume manufacturing.

The ORBIS platform approach delivers many benefits to our customers, such as:

1. Upgrade paths from R&D through to full-scale production

2. Cost-effective solutionslab or fab

3. Seamless process transferfrom lab to fab

4. Low cost of ownership

Memsstars XERIC dry release etch process module is available using vapor Hydrogen Fluoride (HF) andXenon DiFluoride (XeF2) chemistries.

Offers solutions for commercial R&D through to full-scale high volume manufacturing.

XERIC Etch process module offers the strongest approach to effectively releasing MEMS structures from the sacrificial layer, while eliminating the problems associated with alternative approaches, including stiction, incompatible and poorly controlled wet chemistries, poor control and monitoring of stagnant gas systems, and multiplicity of unit