Our Product / Services
We are leaders in the market for providing best range of Lead Free Solder Wire and LEAD FREE WIRE
Leadfree Solder Wire available in Solid andFlux Cored Wire: Gloflo, Tip Booster, Water Soluble, Zero Halide & Zero Halogen, Urea, RMA, RA and No-Clean.
99 C /SN100/ SAC 0307 / SAC 305.
HIFLO SAC305, 405, 387 alloy is designed to be a lead-free substitute for Sn/Pb alloys in most electronics assembly soldering operations. To reduce dross formation, Copper content and improve the joints the product is further enhanced with the addition of minor elements.
ADVANTAGES
Very good drainage.
Best all-around lead-free alternative.
Proven in production use for electronics
manufacturing.
Enhanced wetting characteristics.
High yields and low dross generation.
APPLICATION
HIFLO SAC305, 405, 387 alloy is suitable for Lead free alloy wave soldering and surface mount applications for electronic assemblers. It is suited to single side and mixed technology boards. A solder pot temperature of 255 - 265C is recommended with a contact time 2.3 - 3.5 seconds with suitable wave solder fluxes.