Lead-free solder in commercial use may contain trace amounts of tin, copper, silver, bismuth, indium, zinc, antimony, and other metals. Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solders have melting points in the range of 50 to 200 °C, although there are solders with much lower melting points. Adequate wetting ability for lead-free solder typically requires about 2% flux through the mass. When wave soldering uses lead-free solder, a slightly modified solder pot may be desirable to reduce maintenance costs due to increased tin removal from high-tin solder.

Lead-free solder is prohibited in critical applications such as aerospace, military, and medical projects, as joints under stress are prone to metal fatigue failure. While this is a property of conventional lead solder (as with any metal), the point at which stress fatigue can occur is above stress levels normally experienced. Lead-free solder, on the other hand, will fail no matter how low the voltage level.

Lead-free solder in commercial use may contain trace amounts of tin, copper, silver, bismuth, indium, zinc, antimony, and other metals. Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solders have melting points in the range of 50 to 200 °C, although there are solders with much lower melting points. Adequate wetting ability for lead-free solder typically requires about 2% flux through the mass. When wave soldering uses lead-free solder, a slightly modified solder pot may be desirable to reduce maintenance costs due to increased tin removal from high-tin solder.

Lead-free solder is prohibited in critical applications such as aerospace, military, and medical projects, as joints under stress are prone to metal fatigue failure. While this is a property of conventional lead solder (as with any metal), the point at which stress fatigue can occur is above stress levels normally experienced. Lead-free solder, on the other hand, will fail no matter how low the voltage level.