Thickness of 0.2 to 3.2mm (with finish copper of 1-43 oz), Line width and spacing of 6 6 mils (sample lots 55mils), Minimum finished hole size of 0.3mm, Surface finish of Solder levelling Lead free hot air levelling ENIG., Laminate Tg- 130-180( normal)., Mask finish- Green, White, Red, Blue, Black., Maximum board size- 850 mm x 450 mm.