BESTEM-D531t will enable you to bond ultra precision bondingof NAND FLASH Thin Die Capability 2 motion needleless pick up system, up to 15μm Highest Accuracy Bonding Capability Achieves die-bonding accuracy of ±8μm, θ=±0.05° (3σ) Flexible Handling Able to handle the lead...
Forming sealing packing machine(DZ-5002G) The floor vacuum packing machine is reasonable in structure, stable in performance and convenient in maintenance. On the basis of the existing technology, a lot of improvements and optimizations have been...
Level 61 Menara Two Petronas Klcc Kuala Lumpur, KLP , , Malaysia
14 Years
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