Our Product / Services
Our product range contains a wide range of Sputtering Fabrication Services
• Thin film HMC fabrication facility with physical deposition of metals and semiconducting materials
• Three target sputtering machine with capability of 4”x4” square substrates 4 at a time.
• Presently have SiChrome, Titanium and Copper as three targets
• Can deposit Chromium, Nickel, Gold, Silver, Aluminum, Tungsten, Molybdenum and many others
• Simultaneous and sequential deposition of any above material is possible
• Substrate heating up to 400°C is possible
• Also useful for high temperature vacuum backing