Vadodara, Gujarat, India
Our Products
PAI SnPb40 Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SnPb40 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.
PAI SnAg0.3Cu0.7+Ni+Ge RoHS compliance solder wires are being formulated with high virgin
raw metals processed in state-of-the-art Vaccualloy Technology that brings world class quality
along. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCB
assembly process. Also an increased flow rate & reduced impurities found. PAI
SnAg0.3Cu0.7+Ni+Ge alloy are compatible for a typical range of flux application formulas used in
Electronics Industry today.
PAI Sn99.3Cu0.7 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI Sn99.3Cu0.7 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.
High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals.
Applies at hand or feed soldering processes in Electronics & Electrical assemblies.
Non-corrosive and no impact of flux residues forming at post soldering which means of
passing in pin probe & flying probe tests for No Clean solder wires.
If required, flux residues shall be cleaned with appropriate liquid application.
Prcised amount of flux cored from state-of the-art-technology manufacturing process.
