Persang Alloy Industries Pvt Ltd.

Akota, Vadodara, Gujarat

PAI SnAg0.3Cu0.7+Ni+Ge RoHS compliance solder wires are being formulated with high virginraw metals processed in state-of-the-art Vaccualloy Technology that brings world class qualityalong. Here, oxygen interaction with alloy is nil and thus, dross formulation is reduced at PCBassembly process. Also an increased flow rate & reduced impurities found. PAISnAg0.3Cu0.7+Ni+Ge alloy are compatible for a typical range of flux application formulas used inElectronics Industry today.

PAI Sn99.3Cu0.7 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI Sn99.3Cu0.7 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.

High purity alloy that is composed of 60% Tin and 40% Lead from virgin metals.Applies at hand or feed soldering processes in Electronics & Electrical assemblies.Non-corrosive and no impact of flux residues forming at post soldering which means ofpassing in pin probe & flying probe tests for No Clean solder wires.If required, flux residues shall be cleaned with appropriate liquid application.Prcised amount of flux cored from state-of the-art-technology manufacturing process.