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Vadodara, Gujarat, India
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Soldering Accessories #3418074

Solder Sticks

PAI SP-629 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SP-629 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.
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Solder Paste

PAI SH6209 (Sn62Ag2Pb36) RMA NC Solder Paste




SH-6209


PAItin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of todays demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life.


SH-6209is a Sn62Ag2Pb36 alloy with Type 3 & Type 4 and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.



  • High print speed (0-120 mm/sec)

  • Excellent wettability

  • Reflow with or without nitrogen

  • Low void

  • Over 8 hours stencil life

  • Extended tack time > 12 hours


Download Technical Data Sheet



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Lead Free Solder Paste

PAI PF606 (SAC305) NC Solder Paste





Lead-Free No Clean Solder Paste


PART NO: PF606


The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in PAIslead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life.


PF606is an Sn/Ag3.0/Cu0.5 alloy with Type 3 particle size (+45 m 1% less, -20 m 10% less) and Type 4 particle size (+38 m 1% less, -20 m 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.



  • Pb < 1000 ppm, Cd < 20 ppm

  • High print speed: 0-120 mm/sec

  • Over 8 hours stencil life

  • Extended tack time > 12 hours

  • Excellent wettability

  • Low void


Download Technical Data Sheet



View Complete Details
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  • Chandan Kumar (Persang Alloy Industries Pvt Ltd.)
  • 13/A, Shrinagar Soc. 4- Shreeniketan Appts, Road A, Akota Road, Vadodara, Gujarat - 390020
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Retailer of Soldering Accessories from Vadodara, Gujarat by Persang Alloy Industries Pvt Ltd.
Post Buy Requirement
PA
Vadodara, Gujarat, India
Add Review

Soldering Accessories #3418074

Solder Sticks

PAI SP-629 RoHS Compliance Solder Sticks are being formulated with High Virgin Raw Metals Processed in state-of-the-art Vaccualloy Technology that brings world class Quality along. Here, Oxygen interaction with Alloy is Nil and thus, Dross formulation is reduced at PCB Assembly Process. Also an increase flow rate & reduced impurities found. PAI SP-629 Alloy is compatible for a typical range of Flux Application Formulas used in Electronics Industry Today.
View Complete Details

Solder Paste

PAI SH6209 (Sn62Ag2Pb36) RMA NC Solder Paste

SH-6209

PAItin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of todays demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life.

SH-6209is a Sn62Ag2Pb36 alloy with Type 3 & Type 4 and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

  • High print speed (0-120 mm/sec)
  • Excellent wettability
  • Reflow with or without nitrogen
  • Low void
  • Over 8 hours stencil life
  • Extended tack time > 12 hours

Download Technical Data Sheet

View Complete Details

Lead Free Solder Paste

PAI PF606 (SAC305) NC Solder Paste

Lead-Free No Clean Solder Paste

PART NO: PF606

The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in PAIslead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life.

PF606is an Sn/Ag3.0/Cu0.5 alloy with Type 3 particle size (+45 m 1% less, -20 m 10% less) and Type 4 particle size (+38 m 1% less, -20 m 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

  • Pb < 1000 ppm, Cd < 20 ppm
  • High print speed: 0-120 mm/sec
  • Over 8 hours stencil life
  • Extended tack time > 12 hours
  • Excellent wettability
  • Low void

Download Technical Data Sheet

View Complete Details
Tell Us What are you looking for? Will call you back

Contact Us