Our Products
SH-6209
PAItin/lead/silver no-clean solder pastes are made from a special formulation of highest purity ingredients to ensure the process consistency of todays demanding ultra-fine-pitch challenges. Our formulation offers a wide processing window and excellent shelf life, with full wetting and clean-ability features to prolong stencil life.
SH-6209is a Sn62Ag2Pb36 alloy with Type 3 & Type 4 and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.
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Lead-Free No Clean Solder Paste
PART NO: PF606
The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in PAIslead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life.
PF606is an Sn/Ag3.0/Cu0.5 alloy with Type 3 particle size (+45 m 1% less, -20 m 10% less) and Type 4 particle size (+38 m 1% less, -20 m 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.
Download Technical Data Sheet