Lead Free Solder Paste

Lead-Free No Clean Solder Paste

PART NO: PF606

The higher processing temperatures required for lead-free soldering make unprecedented demands on solder pastes. In addition to consistent printing and reflow requirements, there is a need for higher repeatability in high mix, high-yield lines. All these and other Pb-free challenges are met with consistency in PAI’s lead-free pastes. Processable by air or nitrogen reflow, they offer the advantages of excellent wetting characteristics and long shelf life.

PF606  is an Sn/Ag3.0/Cu0.5 alloy with Type 3 particle size (+45 µm 1% less, -20 µm 10% less)  and Type 4 particle size (+38 µm 1% less, -20 µm 10% less) and no-clean ROL0 flux. It comes packaged in a 500-gram & 250-grams jar.

• Pb < 1000 ppm, Cd < 20 ppm
• High print speed: 0-120 mm/sec
• Over 8 hours stencil life
• Extended tack time > 12 hours
• Excellent wettability
• Low void

Download – Technical Data Sheet