-
Material
Electrolytic Tough Pitch (ETP) copper is used with purity of Copper to 99.90% and Electrolytic grade
-
Applications
Bus way systems , Panel boards and Switchboards
-
Sizes
Width 5mm to 300 mm & Thickness 0.5 to 30mm
-
Plating
Tinned or Silver-plating as per customer specification.
The sleeving process is carried out under controlled temperature and air flow conditions, putting to use Raychem RPG's several years of experience with insulation enhancement systems.We Can produce highly complex accurate Rectangular, Round and Hollow Bus bars of Copper or Aluminium with sleeve without sleeve of various sizes.