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Packaging Foils & Films

We are leaders in the market for providing best range of Thin Film Circuits

Thin Film Circuits

  • Applications Hybrid micro circuits , SAW devices
  • Standard Metallization Scheme Ti : 200 - 800 Ao , Cr : 200 - 800 Ao
Thin film circuit metallization schemes at HHV are deposited by magnetron sputtering method and the deposited metal layers show excellent adhesion compared to other non vacuum deposition methods.These metallization schemes start with abonding layer of TiW or Cr and a conductive layer of Au Cu on the ceramic substrates.
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