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DESCRIPTION
NexGen-BI BOND HMB 34 is a premium quality stitch book binding adhesive under moderate application temperature. It possesses excellent heat stability and machining. The application temperature ranges from 130-150C. This brings major advantages in technical performances, hygiene and safety. The product shows resistance towards charring, gelling and skinning. It possesses low residual tack.
APPLICATION
NexGen-BI BOND HMB 34 stitch book binding adhesive is specifically formulated for medium or short open time. It shows excellent stitch binding with high GSM Maplitho or uncoated paper with good spine flexibility. It is formulated for stitch/staple book binding specially for Maplitho/uncoated paper or wood free paper.
Additional Information:
Payment Terms : L/C, T/T
Packaging Details : AVAILABLE IN: 25 Kgs printed BAG
SHELF LIFE: 12 MONTHS if stored in a cool, dry place
Delivery Time : 2 WEEKS
Some major benefits that may interest you:
This economically as well as environmentally safe glue is best suited for: