ITW ECPS

A picture is worth a thousand words. Take a look at some of our design portfolio and contact us if you see something that you like.

• Dimension2 mils

Polycarbonate shipping tubes are our high performance shipping tube series. Our deep knowledge in shipping tube design, polymer science and extrusion processing technology allows us to produce shipping tubes with +- 2 mils ( +- 50 microns) of dimensional tolerance control. This unique tight tolerance capability helps many of our customers to improve their machine uptime, reduce scrap and minimize rework.

• Green MaterialsPS1,PC2

We are committed to global environment preservation by building a strong sustainability mindset across our organization. We walk the talk. We actively support the 3R concept -- Reduce, Reuse and Recycle.

Halogen free Reduced environmental impact Strongest impact strength Excellent for heavy duty big packages Excellent claritytransparency Application examples: microprocessor heat sink and ceramic TO packages.Polystyrene (PS) 2. Polycarbonate (PC) 3. Polyethylene Terepthalate Glycol (PETG)

• Size105 ohm/sq

If you want to reuse shipping tubes to transport your ICs within your operation without having to worry about antistatic coatings come off the tube surface that could compromise ESD protection, clear top conductive(CTC) and open top conductive polystyrene shipping tubes will be excellent alternative choices. These tubes are compounded with conductive polymers so that they make the tubes permanently conductive with SR less than 105 ohmsq.

Match Metal Technology (MMT) is our unique manufacturing capabilities, which combine proprietary automated high speed pocket embossing and hole punching equipment with precision embossing dies, deliver several advantages - such as consistent indexing hole pitch, low pocket dimension variation and uniform wall thickness.

• DIMENSIONS5mils

For more than 50 years, the semiconductor industry has been relying on shipping tubes as the main medium to carry their components between Assembly and Test operations or to their end customers. Its popularity remains today for two simple reasons - economy and flexibility. We carry more than one thousand open tools that run from through-hole, surface mount to leadless packages (QFN, MLP, etc). Our products also serve the connector, LED and passive component customers.

• Size2.5 x 2.5 mm

We offer Jedec trays that reflect our relentless pursuit in design philosophy to combine the best of both worlds - maximum durability and light weight.

• Dimension5mils

For more than 50 years, the semiconductor industry has been relying on shipping tubes as the main medium to carry their components between Assembly and Test operations or to their end customers. Its popularity remains today for two simple reasons - economy and flexibility. We carry more than one thousand open tools that run from through-hole, surface mount to leadless packages (QFN, MLP, etc). Our products also serve the connector, LED and passive component customers.

• seriesDB 3000

We are one of the pioneers in the development of ESD oriented plastics and laminates. We continue to maintain the ranking as a leading supplier of superior engineered moisture barrier bags and clean room packaging. Drypack DB 3000 series is specifically designed to provide superior moisture vapor barrier yet fully transparent. This proprietary film lamination structure enables you to see through to the contents and perform barcode scanning.

You can rely on MaxiGrip’s barrier closure protection products in unpredictable environments. Our state-of-the-art barrier technology joining solutions are ideal for applications that must withstand extreme conditions. Our products keep what is inside an assembly protected from the environment and prevents undesired external elements that cause damage or contamination from entering. We offer flat or horizontal plane closures (MaxiGrip) and top or vertical closures (U-MaxiGrip) that are re-sealable and practical.

• Size150 mm to 300 mm.

Our wafer packaging systems product line is your cost effective solution to secure storage and transport of semiconductor wafers, ranges from 150 mm to 300 mm. Since 1999, our customers have enjoyed higher yields through a significant reduction in wafer breakage during storage, handling and transport between front end and back end sites. Our horizontal canister boxes are engineered solutions designed for the secure storage and transport of up to 25 wafers within a single box. These solutions are particularly suited to robotic recognition and auto-handling equipment utilized within wafer packaging operations.