Materions proprietary plating process produces flange surfaces that are free of pits, scratches and other defects, thus solving one of your major quality challenges. Our superior quality flanges are plated with Ni:Co + Au for high-performance use in RF transistors, FETs and MMICs. The flange material can be pure Cu, Mo or W, or the composites CuW, CuMo, Cu-CuMo-Cu lamination (CPC), or Cu-Mo-Cu lamination (CMC)Our flanges are plated with electrolytic nickel, copper and gold for reliability and are compatible with AuSi eutectic die attachOur advanced material custom plated flanges accommodate multiple applications to meet your microelectronics device requirements.
Write a Review
(Materion Advanced Materials Group)
Buffalo, NY 14214, United States
Share us via
