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Soldering Accessories

Leading Manufacturer, Supplier & Retailer of UZ-36/04 Leaded Solder Paste, UZ-37/02 Leaded Solder Paste, UZ-55/45 LED Leaded Solder Paste, UZ-63/37 Leaded Solder Paste and UZ-63/37 LED Leaded Solder Paste.

UZ-36/04 Leaded Solder Paste

  • Melting Point 183°C
  • Pack Type PP Bottle
  • Alloy Sn62.8-Pb36.8-Ag0.4
  • Flux Content 10.5±1%
  • Features Good Welding Activation, excellent Auxiliary stretching

Details

  • Good Printing and rolling performance and leak printing performance eventhe spacing of solder pad is low to 0.4mm , can also complete a exquisiteprinting .
  • Can complete continuous printing for a long time almost without collapseafter printing for a few hours small viscosity change SMD Components arenot easyto move.
  • Excellent soldering performance can complete a good wetting in differentparts
  • Less residue after soldering transparent appearance high insulationresistance do not corrode the PCB and meet the disposable requirement.
  • BetterICTTest performance willnot appearthe false judgement.
View Complete Details

UZ-37/02 Leaded Solder Paste

  • Melting Point 183°C
  • Pack Type PP Bottle
  • Alloy Sn62.9-Pb36.9-Ag0.2
  • Flux Content 10.5±1%
  • Features Good Welding Activation, excellent Auxiliary stretching
  • Shelf Life 1 Year

Details :

  • Good Printing and rolling performance and leak printing performance eventhe spacing of solder pad is low to 0.4mm , can also complete a exquisiteprinting .
  • Can complete continuous printing for a long time almost without collapseafter printing for a few hours small viscosity change SMD Components arenot easyto move.
  • Excellent soldering performance can complete a good wetting in differentparts
  • Less residue after soldering transparent appearance high insulationresistance do not corrode the PCB and meet the disposable requirement.
  • Better ICT Test performance will not appear the false judgement.
View Complete Details

UZ-55/45 LED Leaded Solder Paste

  • Melting Point 183°C-203°C
  • Pack Type PP Bottle
  • Alloy Sn 55/ Pb 45
  • Flux Content 10.5±1%
  • Features LED Good welding strength and reliable joint.

Details :

  • Good Printing and rolling performance and leak printing performance eventhe spacing of solder pad is low to 0.4mm , can also complete a exquisiteprinting .
  • Can complete continuous printing for a long time almost without collapseafter printing for a few hours small viscosity change SMD Components arenot easyto move.
  • Excellent soldering performance can complete a good wetting in differentparts
  • Less residue after soldering transparent appearance high insulationresistance do not corrode the PCB and meet the disposable requirement.
  • Better ICT Test performance wil lnot appear the false judgement.
View Complete Details

UZ-63/37 Leaded Solder Paste

  • Melting Point 183°C
  • Pack Type PP Bottle
  • Alloy Sn63 Pb37
  • Flux Content 10.5±1%
  • Features Good Welding Activation, excellent Auxiliary stretching

Details :

  • Good Printing and rolling performance and leak printing performance eventhe spacing of solder pad is low to 0.4mm , can also complete a exquisiteprinting .
  • Can complete continuous printing for a long time almost without collapseafter printing for a few hours small viscosity change SMD Components arenot easyto move.
  • Excellent soldering performance can complete a good wetting in differentparts
  • Less residue after soldering transparent appearance high insulationresistance do not corrode the PCB and meet the disposable requirement.
  • Better ICT Test performance will not appear the false judgement.
View Complete Details

UZ-63/37 LED Leaded Solder Paste

  • Melting Point 183°C
  • Pack Type pP Bottle
  • Alloy Sn 63/ Pb 37
  • Flux Content 10.5±1%
  • Features LED Good welding strength and reliable joint.

Details :

  • Good Printing and rolling performance and leak printing performance eventhe spacing of solder pad is low to 0.4mm , can also complete a exquisiteprinting .
  • Can complete continuous printing for a long time almost without collapseafter printing for a few hours small viscosity change SMD Components arenot easyto move.
  • Excellent soldering performance can complete a good wetting in differentparts
  • Less residue after soldering transparent appearance high insulationresistance do not corrode the PCB and meet the disposable requirement.
  • Better ICT Test performance will not appear the false judgement.
View Complete Details

UZ – 03/07 Lead Free Solder Paste

  • Melting Point 217°C-227°C
  • Alloy Sn 99-Ag 0.3-Cu 0.7
  • Powder Shape ≥95 %
  • Flux Content 11.5±1%
  • Features High Welding Performance and good looks can probe non-brittle residue low initiation rate.

Details :

  • Good Printing and rolling performance and leak printing performance even
  • the spacing of solder pad is low to 0.4mm , can also complete a exquisite
  • printing .
  • Can complete continuous printing for a long time almost without collapse
  • after printing for a few hours small viscosity change SMD Components are
  • not easyto move.
  • Excellent soldering performance can complete a good wetting in different
  • parts
  • Less residue after soldering transparent appearance high insulation
  • resistance do not corrode the PCB and meet the disposable requirement.
  • BetterICTTest performance willnot appearthe false judgement.
View Complete Details

UZ – 3/05 Lead Free Solder Paste

  • Melting Point 217°C
  • Alloy Sn 96.5-Ag3-Cu0.5
  • Powder Shape ≥95 %
  • Flux Content 11.5±1%
  • Features High Welding Performance and good looks can probe non-brittle residue low initiation rate.

Details :

  • Good Printing and rolling performance and leak printing performance even the spacing of solder pad is low to 0.4mm , can also complete a exquisite printing .
  • Can complete continuous printing for a long time almost without collapse after printing for a few hours small viscosity change SMD Components are not easyto move.
  • Excellent soldering performance can complete a good wetting in different parts
  • Less residue after soldering transparent appearance high insulation resistance do not corrode the PCB and meet the disposable requirement.
  • Better ICT Test performance will not appear the false judgement.
View Complete Details

UZ – 35/03 Lead Free Solder Paste

  • Melting Point 172°C
  • Alloy Sn64.7-Bi35-Ag0.3
  • Powder Shape ≥95 %
  • Flux Content 11.5±1%
  • Features Moderate temperature, high cost performance.

Details

  • Good Printing and rolling performance and leak printing performance even
  • the spacing of solder pad is low to 0.4mm , can also complete a exquisite
  • printing .
  • Can complete continuous printing for a long time almost without collapse
  • after printing for a few hours small viscosity change SMD Components are
  • not easyto move.
  • Excellent soldering performance can complete a good wetting in different
  • parts
  • Less residue after soldering transparent appearance high insulation
  • resistance do not corrode the PCB and meet the disposable requirement.
  • Better ICT Test performance will not appear the false judgement.
View Complete Details

UZ – 35/10 Lead Free Solder Paste

  • Melting Point 151°C-189°C
  • Alloy Sn64-Bi 35-Ag1
  • Powder Shape ≥95 %
  • Flux Content Moderate temperature, high cost performance.

Details

  • Good Printing and rolling performance and leak printing performance even the spacing of solder pad is low to 0.4mm , can also complete a exquisite printing .
  • Can complete continuous printing for a long time almost without collapse after printing for a few hours small viscosity change SMD Components are not easyto move.
  • Excellent soldering performance can complete a good wetting in different parts
  • Less residue after soldering transparent appearance high insulation resistance do not corrode the PCB and meet the disposable requirement.
  • Better ICT Test performance will not appear the false judgement.
View Complete Details
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