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    UZ – 35/10 Lead Free Solder Paste

    • Melting Point151°C-189°C
    • AlloySn64-Bi 35-Ag1
    • Powder Shape≥95 %
    • Flux ContentModerate temperature, high cost performance.
    • Supply TypeExporter, Supplier
    • Preferred Buyer Location All over the world

    Details Good Printing and rolling performance and leak printing performance even the spacing of solder pad is low to 0.4mm , can also complete a exquisite printing . Can complete continuous....
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    Company Information

    • calendar Member Since 8 Years
    • building Nature of Business Retailer
    • gst icon GST No. 09AAEFA2539A1ZY

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    Details

    • Good Printing and rolling performance and leak printing performance even the spacing of solder pad is low to 0.4mm , can also complete a exquisite printing .
    • Can complete continuous printing for a long time almost without collapse after printing for a few hours small viscosity change SMD Components are not easyto move.
    • Excellent soldering performance can complete a good wetting in different parts
    • Less residue after soldering transparent appearance high insulation resistance do not corrode the PCB and meet the disposable requirement.
    • Better ICT Test performance will not appear the false judgement.


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