Shenzhen Sunsom Automatic Equipment Co.,Ltd .

Shenzhen, guangdong, China

We are offering fog/fob bonding machines. 1. About the application field of fogfob bonding equipment xcm71 - a5 fog fob bonding equipment is widely used in a variety of lcd and the large size of display panel's production and maintenance; such as: television (tv), laptop computers (note book), liquid crystal display (monitor), tablet pc (pad ), lcd lcm production enterprises. 2.about the basic parameters of fogfob bonding equipment xcm71 -a5input power: ac220v 50-60hz working pressure :0.4-0 .8 mpa operating modes: 7-inch hmi dimensions: l2210 w1730 h1500 mm the method of heating: heating or pulse heating thermostat the quantity of fixture: 2 group x-y- micrometer adjustable range of temperature : rt-500 control program: plc controller body main material: steel + baking varnishthe thermocouple: k type 3.about the functions and characteristics of the fogfob bonding equipment xcm71 - a5 3.1use pneumatic components of japan smc and high-precision the moving parts 3.2 use temperature controller of japan and the function module of the integral pid self-tuning temperature, accurate temperature. 3.3 imported plc control:the operation of 7-inch full-color touch-screen 3.4sunsom the elimination structure of double-cylinder deadweight, accurate pressure.