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Contact SupplierWe are offering fog/fob bonding machines.
1. About the application field of fogfob bonding equipment xcm71 - a5
fog fob bonding equipment is widely used in a variety of lcd and the large size of display panel's production and maintenance; such as: television (tv), laptop computers (note book), liquid crystal display (monitor), tablet pc (pad ), lcd lcm production enterprises.
2.about the basic parameters of fogfob bonding equipment xcm71 -a5
input power: ac220v 50-60hz
working pressure :0.4-0 .8 mpa
operating modes: 7-inch hmi
dimensions: l2210 × w1730 × h1500 mm
the method of heating: heating or pulse heating thermostat
the quantity of fixture: 2 group x-y-î¸ micrometer adjustable
range of temperature : rt-500
control program: plc controller
body main material: steel + baking varnish
the thermocouple: k type
3.about the functions and characteristics of the fogfob bonding equipment xcm71 - a5
3.1use pneumatic components of japan smc and high-precision the moving parts
3.2 use temperature controller of japan and the function module of the integral pid self-tuning temperature,accurate temperature.
3.3 imported plc control:the operation of 7-inch full-color touch-screen
3.4sunsom the elimination structure of double-cylinder deadweight, accurate pressure.