Shenzhen Forestall Exact Equipment Co.

shenzhen, China

• MOQ 3 Set(s)
• laptop motherboard rework machinenotebook rework machine

We have Infrared Bga Rework Station - Rf7500. function Parameter *. two Independent Heating Zones, Multitude Temperature Zones Control, Lead Free Process. *. top Heating Zone Use to Infrared *. the Bottom Zone Applies to Far Infrared to Pre-heating to Prevent Pcb Curve. *. six-section Temperature Controls, Simulates Re-flower Effect Completely. *. cools Pcb After Heating, to Prevent Pcb Deflection. *. bga Welding On Completion of the Demolition, a Voice Prompt *. vacuum Wand Sucks Bga, Convenient, Reliable and Durable *. card Board with a Special Tooling for a Wide Variety of Notebook Motherboard(option ) *. com Connection, Connect with Computer to Achieve Hi-end Rework Function. model rf7500 solder Type normal Solder/lead Free smd âµbgaã??bgaã??cspã??qfp thickness 0.5-4mm pcb Size max 250mmw*200mml heating/consumption(upper) ir /250w heating/consumption(bottom) ir/1200w control com Connection, Pc Connected max Consumption 1.5kw power 220v or 380v or 110v dimension 300mml X 330mmw X 360mmh weight 14kg packet carton.

• MOQ 1 Set(s)
• optical alignment soldering machineautomatic soldering machine
• Min 1mm IC can be reworkedwelding ,mounting and countpoint position all can be progarmmed and memoried,parameter limiteless

Specification: infrared Rework Station model ir5020 solder Type normal Solder/lead Free smd âµbga, Bga, Csp, Qfp Etc pcb Thickness 0.5~4mm pcb Size max 300mmw*350mml heating/consumption(upper) Ir/600w heating/consumption(bottom) ir/2600w + Hot Flow/1200w steps 6 Steps adjusting for Vacuum â± 15â° positioning Pcb outer or Jig driver Ball Bearing Thread moving step Motor control pc Base Windows Xp max Consumption 4.6kw power 220v or 380v dimension 880mml X 890mmw X 880mmh weight 120kg Features: bga Rework Station 1. can Repair 1mm Size Chip. 2. windows Xp System, Multi-language Interface, Operation Easy with Functional Software. 3. auto-operation. Heatiing Suction and Sucker Working are Controlled By Computer. 4. welding, Mounting and Countpoint Positions all Can Be Progamm and Memory, Parameter Limitless. 5. three Independent Heating Zones, Suitable Lead-free Process, No Nozzle. 6. qualified Heating Material At the Bottom of Bga, Which Make Hi-temperature with Breeze that is Superior to Infra Heating Board Only. 7. special Pallet for Different Pcb Board. 8. panasonic Plc, Hi Temperature Control Precision. 9. ccd Visual System Available, Surveying the Process of Bga Tin Ball Melting and Reflow ir5020 Infrared Rework Station

• MOQ 3 Set(s)
• touch screen BGA rework machinehot air soldering machine

1. this Machine Uses the Intelligent Heating, When the Fan Non-move, Heating is Not Receiving Power. 2. the Com Connection, with the Computer Connection, Realizes the High-end to Return to the Machinery of Repair Function. 3. Rich Software Function: Contact Surface Succinct Friendly, the Hypothesis, the Revision, the Preserved Parameter, the Parameter Number of Classes Has Not Limited; the Temperature Curve Test, the Analysis, the Printing, Preserve; the Automatic Tracking Thermal Process, the Thermal Process Curve Draws Up Automatically; Temperature Installation, Temperature Drift Correction; Password Locking Mechanism, Condition Permission Mechanism and So On. 4. Three .independent Heating Zone, Suitable for Lead-free Process. 5. the First Heating Zone, a Second Heating Zone Heater Using High-temperature Heating Material, Producing a Breeze, the Third Heating Zone Infrared Heating Plate Heater to Prevent Pcb Deformation; 6.6 Temperature Controls that Simulate the Effect of Reflowing Solder Machine. 7. the First Heating Zone Heater Can Be Adjusted Up and Down, Around, Easy Operation; 8. After the Adoption of the Heating of Large Flow Constant Fan On Pcb for Cooling to Prevent Pcb Welding Deformation, Guarantee; 9. Bga Remove, Welding is Voice Prompts; 10. Hand-held Vacuum Wand Sucks Bga, Convenient, Reliable, Durable; 11. Card Board with a Special Tooling for a Wide Variety of Notebook Motherboard; 12. With. More Than One Size of Hot Air Nozzle, or According to Special Requirements for Custom; 13. Adopting. P L C, Human-machine Interface Control. model rd500 solder Type Normal Solder/lead Free Smd µbga、bga、csp、qfp Etc. pcb Thickness 0.5-4mm pcb Size max 380mmw*400mml heating/consumption(upper) hot Flow /800w heating/consumption(bottom) ir/3100w + Hot Flow/800w heating Steps 6steps pcb Adjusting for Table(x or Y) x:±10m Y:±10mm position Pcb outer or Jig driver Gear, Rack Moving Manual control plc, Have Com , Can Connect Pc max Consumption 4.9kw power 220v or 380v or 110v dimension 760mml X 700mmw X 600mmh