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Contact SupplierWe are offering 660 mobile phone infrared bga rework station for laptop motherboard.
Total power:max 6600w
upper heating power:1200w
lower heating power:second zone: 1200w, third zone: ir 4200w
power supply:(single phase)ac 220v±10v 50hz±3hz 5.4 kva
machine dimension:l1200*w800*h900mm
positioning way:v-shape card slot, pcb holder can be adjustable by x and y axes
temperature controlling :k-type thermocouple closed loop control, independent temperature control
pcb size(max):450*450mm
pcb size (min):10*10mm
pcb blowup diploid:2-50x
weight:150kg
thermocouple ports:3units