Grinding Wheels

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Thinning Grinding Wheel

Min. Order (MOQ) 5 Piece(s)
Size O.D.200~304mm, rim Width_2~10mm, Thickness_5-10mm
Number Of Flower 6A2, 6A2T
Brand Name Sail-tech
Material Diamond
Hardness Normal
Bonding Agent Resin
Viscosity 25-75
Country of Origin China
Model Number SD1000-N50-BR05 200D-3W-5 T

Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire . Quality stability , Free Cutting. Type:6A2, 6A2T

Abbrasive :Diamond Bond:Vitrified Features:Sharpening, high efficiency and precision without chipping and scratching, reasonable price , replace the wheels imported.

For the Machines:SHUWA SGM-6301, NTS Nano Surface-180G, NTS Nano Surface 250/NC-VDM, WEC.

Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes.

Additional Information:

Payment Terms : L/C, T/T,

Packaging Details : We can pack according to clients' requirement.

Delivery Time : Within 15 days after receiving the order.

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