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Member Since 9 Years
Nature of Business Supplier Year of Establishment 2010Ask for more detail from the seller
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Vitrified diamond wheels for thinning and finishing of silicon wafer and sapphaire . Quality stability ,Free Cutting. Type:6A2,6A2T
Abbrasive :Diamond Bond:Vitrified Features:Sharpening,high efficiency and precision without chipping and scratching,reasonable price ,replace the wheels imported.
For the Machines:SHUWA SGM-6301,NTS Nano Surface-180G,NTS Nano Surface 250/NC-VDM,WEC.
Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes.
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