Thermal pastes can be applied to the base and mounting studs of diodes, transistors, heat sinks, rectifiers and semi-conductors, to name but a few. When the contact surfaces are placed together, a firm metal-to-metal contact will only be achieved on 40 – 60% of the interface,...
We offer heat sink compound. Thermal compound is a small, but very important part of processor cooling. Alternatively referred to as Thermal grease, heat sink paste, heat sink compound, heat dope, heat sink jelly, thermal gunk, and silicon compound,...
Application : used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers.
Heat : Resistant up 2000 C.
Feature : Capable of high thermal conductivity,Bleed resistant, non-drying, non-melt and non-curing in nature.
Brand – Technotech Thermal Grease Paste Compound Silicone for CPU Heat Sink Thermal coupling of electrical electronic device to heat sinks Net Weight: approx. 12 gms High Thermal Conductivity, Low Bleed and Stable at high temperature...
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