DDR3, an established DDR DRAM interface technology supports data rates of 800 to 1600 Mbps with clock frequencies of 400 to 800 MHz; double that of DDR2. With a standard operating voltage of 1.5V, DDR3 cuts power consumption of DDR2 by 30%.
Molex offers low-profile and very-low-profile SMT and press-fit Aerodynamic DDR3 DIMM sockets that maximize air flow around memory modules during operation. With a 2.40mm seating plane, these sockets enable the use of very low-profile modules with maximum seating heights below 2.80mm, in ATCA* blade systems. Press-fit sockets feature smaller eye-of-needle compliant pins that increase trace-routing density between holes on the PCB for greater PCB real estate savings. SMT versions are halogen-free and lead-free. The sockets 10 milliohms low-level contact resistance make them excellent for power savings, especially in blade systems.
Molex offers ultra-low-profile DDR3 DIMM sockets with 1.10mm seating plane with low-level contact resistance of 10 milliohms. These sockets provide optimum design flexibility by allowing the use of very low-profile memory modules with maximum seating heights below 2.80mm in ATCA blade systems.

DDR3, an established DDR DRAM interface technology supports data rates of 800 to 1600 Mbps with clock frequencies of 400 to 800 MHz; double that of DDR2. With a standard operating voltage of 1.5V, DDR3 cuts power consumption of DDR2 by 30%.
Molex offers low-profile and very-low-profile SMT and press-fit Aerodynamic DDR3 DIMM sockets that maximize air flow around memory modules during operation. With a 2.40mm seating plane, these sockets enable the use of very low-profile modules with maximum seating heights below 2.80mm, in ATCA* blade systems. Press-fit sockets feature smaller eye-of-needle compliant pins that increase trace-routing density between holes on the PCB for greater PCB real estate savings. SMT versions are halogen-free and lead-free. The sockets 10 milliohms low-level contact resistance make them excellent for power savings, especially in blade systems.
Molex offers ultra-low-profile DDR3 DIMM sockets with 1.10mm seating plane with low-level contact resistance of 10 milliohms. These sockets provide optimum design flexibility by allowing the use of very low-profile memory modules with maximum seating heights below 2.80mm in ATCA blade systems.