4 Layer FR4 1.6mm HDI EING PCB

Hdi pcbs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology hdi pcbs have multiple layers of copper filled stacked microvias (advanced hdi pcbs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products. Pcb features:1.layer: 42.material: fr43.thickness:1.6mm 4.copper: 1oz 5.mini hole: 0.3mm7.mini width/space: 0.2mm/0.2mm8.finish: immersion gold  9.blind holes:gtl-inner 2 our manufacturing capability:manufacture capability layers: 1-32 layersmaterials: cem1, cem3, teflon, rogers, fr-4, high tg fr-4, aluminum base, halogen freemax board size: 510*1200mmmaterial: rohs directive-compliantpcb thickness: 1.6mm-6.4mmout layer copper thickness: 1-6ozinner layer copper thickness: 1oz-12ozmax board thickness: 6.0mmminimum hole size: 0.150mmminimum line width/space: 3/3milmin s/m pitch: 0.1mm (4mil)plate thickness and aperture ratio: 12:1minimum hole copper: 20μmhole diameter tolerance (pth): ±0.075mm (3mil)hole diameter tolerance (npth): ±0.05mm (2mil)hole position deviation: ±0.05mm (2mil)outline tolerance: ±0.05mm (2mil)surface finish: hasl leadfree, immersion enig, chem tin, flash gold, osp, gold finger, peelable, immersion silver,enepigsolder.