Alternative Polyimide Tape

Wave solderHot air leveling tape. 1 and 2 mil Electrical Grade Polyimide Kapton™ films and Kapton™ alternatives coated with a high performance silicone adhesive. Thin and conformable, with outstanding tear and abrasion resistance at elevated temperatures. Adhesive will thermoset to increase adhesion values. Leaves minimal residue when removed after manufacturing process; reduces clean-up time and minimizes rejects. Permits observation of board during processing. Excellent resistance to acids, oils, solvents, aging, staining, water immersion. Protects gold contacts from molten solder during hot air wave solder leveling process. Adhesion: 25 ozin. Tensile: 30 Ibsin. Elongation: 55%. Temp, resistance: 500F. Dielectric strength: 6500V. Color: Amber (transparent). UL510 approved for flame retardance. Can meet Mil spec: MIL-P-46112B when required. 3 inch plastic core.