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Contact SupplierApplications of back grinding wheels:
1:Back thinning, rough grinding and fine grinding of silicon wafer.
2:Workpiece processed include silicon wafer of discrete devices, integrated chips (IC) and virgin etc.
Advantages of back grinding wheels:
1:good Self-dressing ability
2:Long life and low prices
3:high heat conductivity
4:high wear resistance
5:low coefficient
Applicable grinding machine:
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.
The specification of diamond back grinding wheels:
Model | Diameter (mm) | thickness (mm) | hole (mm) |
6A2 | 175 | 30, 35 | 76 |
200 | 35 | 76 | |
350 | 45 | 127 | |
6A2T | 195 | 22.5, 25 | 170 |
280 | 30 | 228.6 | |
6A2T(three ellipses) | 350 | 35 | 235 |
209 | 22.5 | 158 |