Backplane Module Interconnect System

Sealed all-metal construction. Electronically passive,
no active electronics.
5, 10, 20 IO slot BMI sizing.
Pinless IO slots using inductive interconnection.
Symmetric IO slots with inductive coupling.
Redundant Power, Control, IO Module support.
Operating temperature -40 C to +80 C. No fans.
Highest calculated MTBF possible for an ICS. Holistic
thermal coupling. Heat sink and passive cooling for all
system modules. Best system ambient temperature
performance. +50-year life. Higher durability. Extreme
EMP and EFT hardened. IEC600068 durability
hardened. FIPS 140-2 anti-tamper compliant. Intrinsic
cyber hardening.