Bga Chips

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. Ball-grid array packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes. A BGA device is never mounted in a socket in use.