BGA Resin Bond Blade Resin Bond Dicing Blades Diamond Dicing Tools Factory

Get Latest Price

Supply TypeManufacturer, Exporter, Supplier
Preferred Buyer Location All Countries Except India

View More Details

Send Enquiry

Company Information

Suzhou Sail Science & Technology Co. Ltd.

Suzhou

View Number

Member Since 8 Years
Nature of Business Supplier
Year of Establishment 2010

Ask for more detail from the seller

Contact Supplier

Report incorrect details

View Company Details

Product Details
Company Details

Resin bond blade has Rich elasticity and good self-sharpening, it is widely used in singulation field of semiconductor packaging materials and optical materials. A series of bonds in our company can meet different cutting requirements. What’s more, we can provide customers service for different specifications and types according their needs.
Product characteristics

New bond will be developed according to processing materials.
Customer can customize blades of different specifications and work performance.
New hot pressing molding technology ensures product quality stability.

How To Make An Order

More details for your description,more proper blades or wheels you could get,please let us know :
- Type : such as 1A8.1V8,1E8...
- Size: Diameter, Thickness, Hole, Width and depth of abrasive layer, angle Specification Abrasive(D or CBN),Grit,Bond,Concentration
- Work-piece Material, Grinding process (wet or dry)

Specifications

OD(mm)		Thickness(mm)		ID(mm)
(Size)	(Tolerance)	(Size)	(Tolerance)	(Size)	(Tolerance)
52-56	0--+0.05	0.04-0.07	+-0.002	40	0--+0.02
52-60	0--+0.05	0.05-0.20	+-0.003	40	0--+0.02
52-60	0--+0.05	0.20-0.50	+-0.005	40	0--+0.02
60-80	0--+0.05	0.20-0.50	+-0.01	40	0--+0.02
80-150	0--+0.05	0.20-0.50	+-0.01	40-130	0--+0.02