Ceramic Sheet Direct Platted Copper Magnetron Sputtering Deposition System

Summary: The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate. Cooper conductive film deposition on Aluminum Oxide (Al2O3), AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing

methods: DBC LTCC HTCC, much lower production cost is its high feature.

Royal technology team assisted our customer to developed the DPC process successfully with PVD sputtering technology.

Keywords: Ceramic sealing parts, DPC process, Copper PVD Sputtering system, LED Ceramic Chips With Cooper Plating, Al₂O₃, AlN Ceramic Circuit Boards, Al2O3 Plates On LED, Semiconductor

Applications of DPC:

· HBLED

· Substrates for solar concentrator cells

· Power semiconductor packaging including automotive motor control

· Hybrid and electric automobile power management electronics

· Packages for RF

· Microwave devices

DPC Technology Performance

       Various substrate materials: Ceramic (Al3O2, AlN), Glass, and Si

• Much lower production cost.
• Outstanding thermal management and heat-transfer performance
• Accurate alignment and pattern design
• Robust metallization adhesion

Features:

• High throughput up to 2.2 ㎡ Ceramic substrate per cycle;
• Strong adhesion with powerful heating-up device and plasma source cleaning;
• Compact design and with easy access for upgrading and maintenance work.
• Fully Automation, PLC+Touch Screen, one-touch control system.
• High efficiency with less power consumption, max. 50% production cost saving.