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    Chipboard Encapsulated Panel

    • COREHigh density E1-grade chipboard
    • DIMENSIONS600 mm x 600 mm
    • BOTTOMGalvanized Iron Sheet
    • PANEL THICKNESS27 mm | 31 mm
    • TOPGalvanized Iron Sheet
    • Supply TypeManufacturer
    • Preferred Buyer Location India only
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    • calendar Member Since 2 Years
    • building Nature of Business Manufacturer
    • Year of Establishment 1994

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    • BOTTOMGalvanized Iron Sheet
    • TOPGalvanized Iron Sheet
    • PANEL THICKNESS27 mm | 31 mm
    • DIMENSIONS600 mm x 600 mm
    • COREHigh density E1-grade chipboard

    This double folded lock constructs into a panel that has a unique in-built stringer at the underside of each panel edge. This unique engineering exhibits fine dimensional tolerances for modular control, accurate alignment of grids & inter-changeability of panels that complies with the Euro Class requirement of EN 12825.


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    • Chipboard Encapsulated Panel
    • Chipboard Encapsulated Panel
    • Chipboard Encapsulated Panel
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