Chipboard Non-encapsulated Panel For Open Office, Data Center, Control Room, Casino, Co-working, Education

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ApplicationOpen Office,Data Center,Control Room,Casino,Co-working,Education
COREHigh density E1-grade chipboard
PANEL THICKNESS35 mm | 38 mm
BOTTOMGalvanizes Iron Sheet / Aluminium foil
Supply TypeManufacturer, Exporter, Supplier, Retailer, Distributor, Trader
Preferred Buyer Location All over the world

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Company Information

UNITILE

Andheri, Mumbai, Maharashtra

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Member Since 2 Years
Nature of Business Manufacturer
Year of Establishment 1994

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Product Details
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ApplicationOpen Office,Data Center,Control Room,Casino,Co-working,Education
PANEL THICKNESS35 mm | 38 mm
COREHigh density E1-grade chipboard
DIMENSIONS600 mm x 600 mm | 600 mm x 800 mm
TOPGalvanized Iron Sheet / HPL / PVC
BOTTOMGalvanizes Iron Sheet / Aluminium foil

Unitile Chip Board (Non-Encapsulated) panels constructed around a high density E1 grade chipboard core. The system fully complies with the Euro Class requirement of EN 12825. The base and the top surface of the core is factory bonded using an appropriate combination of surface finishes such as Aluminum, Galvanized Iron sheet, High Pressure Laminate etc.

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